SP

Solder paste for reflow and vapor phase soldering

SP is a REL0 classified bismuth no-clean solder paste formulation for low temperature applications.

The SP is designed in the low melting standard alloy BSA04 for reflow and vapor phase processes. The melting range of 138 - 142°C protects temperature-sensitive components and is ideal for a secondary soldering process in double sided reflow applications.

Classification

DIN-EN-ISO-9454-1: 2016		1232
IPC-J-STD-004-A: 2004		REL0
IPC-J-STD-005: 1995 (powder)		T3
Particle size	[µm]	25-45

Package and storage

Jar	PP [g]	500
Small cartridge	HDPE [g]	650
Big cartridge	HDPE [g]	1300
Cassette	[g]	800
Shelf life (Months)
Storage conditions	4 - 10 °C	5

Product data sheet	Safety data sheet	Application note

Additional documentation

SP

Solder paste for reflow and vapor phase soldering

Classification

Package and storage

Request safety data sheet