SP

Solder paste for reflow and vapor phase soldering

SP is a REL0 classified bismuth no-clean solder paste formulation for low temperature applications.

The SP is designed in the low melting standard alloy BSA04 for reflow and vapor phase processes. The melting range of 138 - 142°C protects temperature-sensitive components and is ideal for a secondary soldering process in double sided reflow applications.

Classification

DIN-EN-ISO-9454-1: 2016   1232
IPC-J-STD-004-A: 2004   REL0
IPC-J-STD-005: 1995 (powder)   T3
Particle size [µm] 25-45

Package and storage

Jar

PP [g]

500

Small cartridge

HDPE [g]

650

Big cartridge

HDPE [g]

1300

Cassette

[g]

800

Shelf life (Months)    
Storage conditions

4 - 10 °C

5

Product data sheet Safety data sheet Application note