On 5 January 2024, the European Commission amended Annex VI in Part 3 of Regulation (EC) No 1272/2008 on classification, labelling and packaging of substances and mixtures (CLP Regulation) for the purpose of adapting it to technical and scientific progress (ATP). This is the 21st adaptation.

The regulation affects a total of 51 entries, with 27 new entries added and 24 entries replaced. For example, the entries for solid lead, lead powder and other substances have been amended.
This has implications for product labelling and transport conditions. As a result of the 21st ATP, the exemption for the labelling of mixtures in accordance with Section 1.3.4 of the CLP Regulation no longer applies to lead.

Delegated Regulation (EU) 2024/197 will apply from 1 September 2025.

Wave soldering applications with or without nitrogen, selective soldering, dip tinning, cable assembly by hand or machine, manual soldering and many other processes have different requirements for the choice of soldering materials especially to fluxes.

The genesis of a unique solder paste platform with 8 different alloys and 3 powder types: JEAN-151

To ensure long-term reliability of lead-free solders under harsh environmental conditions SN100CV_® exploits the Bi-effect to ensure long-term reliability of electronic devices under harsh environmental conditions through an ingenious alloying mechanism.