OT2

Solder paste for reflow soldering

OT2 is a ROL0 classified, halogen- and halide-free no-clean solder paste formulation that can be combined with many lead-containing alloys.

OT2 is characterized by printing speeds up to 250mm/s and reduces typical oxidation defects such as graping and head-in-pillow due to the balanced activator system. The standard alloys SN62 and SN63 are particularly suitable for the reflow process. OT2 can be processed with or without nitrogen.

Classification

DIN-EN-29454-1: 1994		1.1.3.C
IPC-J-STD-004-A: 2004		ROL0
IPC-J-STD-005: 1995 (powder)		T3/T4
Particle size	[µm]	25-45/20-38

Package and storage

Jar	PP [g]	500
Small cartridge	HDPE [g]	650
Big cartridge	HDPE [g]	1300
Cassette	[g]	800
Shelf life (Months)
Storage conditions	4 - 10 °C	12

Alloy	Product data sheet	Safety data sheet	Application note
SN62-T3
SN62-T4
SN63-T3
SN63-T4

Additional documentation

OT2

Solder paste for reflow soldering

Classification

Package and storage

Request safety data sheet