OT2

Solder paste for reflow soldering

OT2 is a ROL0 classified, halogen- and halide-free no-clean solder paste formulation that can be combined with many lead-containing alloys.

OT2 is characterized by printing speeds up to 250mm/s and reduces typical oxidation defects such as graping and head-in-pillow due to the balanced activator system. The standard alloys SN62 and SN63 are particularly suitable for the reflow process. OT2 can be processed with or without nitrogen.

Classification

DIN-EN-29454-1: 1994  

1.1.3.C

IPC-J-STD-004-A: 2004  

ROL0

IPC-J-STD-005: 1995 (powder)  

T3/T4

Particle size

[µm]

25-45/20-38

Package and storage

Jar

PP [g]

500

Small cartridge

HDPE [g]

650

Big cartridge

HDPE [g]

1300

Cassette

[g]

800

Shelf life (Months)    
Storage conditions

4 - 10 °C

12

Alloy Product data sheet Safety data sheet Application note
SN62-T3
SN62-T4
SN63-T3
SN63-T4