Solder paste for reflow soldering
OT2 is characterized by printing speeds up to 250mm/s and reduces typical oxidation defects such as graping and head-in-pillow due to the balanced activator system. The standard alloys SN62 and SN63 are particularly suitable for the reflow process. OT2 can be processed with or without nitrogen.
|IPC-J-STD-005: 1995 (powder)||