OT2
Solder paste for reflow soldering
OT2 is characterized by printing speeds going up to 250mm/s and reduces typical oxidation defects such as graping and head-in-pillow due to the balanced activator system. The standard alloy SAC305 is particularly suitable for the reflow process. For higher requirements with a higher silver content, the alloy SAC405 is available. The alloys SN100C®, SCA0703 and SCAN-Ge071 can also be used in the reflow process. Furthermore, the melting range of the alloys SCAN-Ge071 and SCA0703 makes them ideal for use in the vapor phase to minimize tombstone effects.