OT2

Solder paste for reflow soldering

OT2 is a ROL0 classified, halogen and halide free, no-clean solder paste formulation that is compatible with many lead-free alloys.

OT2 is characterized by printing speeds going up to 250mm/s and reduces typical oxidation defects such as graping and head-in-pillow due to the balanced activator system. The standard alloy SAC305 is particularly suitable for the reflow process. For higher requirements with a higher silver content, the alloy SAC405 is available. The alloys SN100C®, SCA0703 and SCAN-Ge071 can also be used in the reflow process. Furthermore, the melting range of the alloys SCAN-Ge071 and SCA0703 makes them ideal for use in the vapor phase to minimize tombstone effects.

Classification

DIN-EN-29454-1: 1994  

1.1.3.C

IPC-J-STD-004-A: 2004  

ROL0

IPC-J-STD-005: 1995 (powder)  

T3/T4

Particle size

[µm]

25-45/20-38

Package and storage

Jar

PP [g]

500

Small cartridge

HDPE [g]

650

Big cartridge

HDPE [g]

1300

Cassette

[g]

800

Shelf life (Months)    
Storage conditions

4 - 10 °C

12

Alloy Product data sheet Safety data sheet Application note
SAC305-T3
SAC305-T4
SAC405-T3
SAC405-T4
SAC0307-T3
SCANGe071-T3
SCANGe071-T4
SN100C-T3
SN100C-T4