F3+

Solder Paste for Reflow and Vapor Phase Soldering

F3+ is a REL0 classified, halide-free, no-clean solder paste formulation that can be combined with many lead-containing alloys.

Standard alloys S62, S63 and S6M are particularly suitable for reflow and vapor phase processes. F3+ can be processed with or without the use of nitrogen.

Classification

DIN-EN-29454-1: 1994  

1.2.3.C

IPC-J-STD-004-A: 2004  

REL0

IPC-J-STD-005: 1995 (powder)  

T3/T4

Particle size

[µm]

25-45/20-38

Package and storage

Jar

PP [g]

500

Small cartridge

HDPE [g]

650

Big cartridge

HDPE [g]

1300

Cassette

[g]

800

Shelf life (Months)    
Storage conditions

4 - 10 °C

6

Alloy Product data sheet Safety data sheet Application note
S62-T3
S62-T4
S63-T3
S63-T4