F3+

Solder Paste for Reflow and Vapor Phase Soldering

F3+ is a REL0 classified, halide-free, no-clean solder paste formulation that can be combined with many lead-containing alloys.

Standard alloys S62, S63 and S6M are particularly suitable for reflow and vapor phase processes. F3+ can be processed with or without the use of nitrogen.

Classification

DIN-EN-29454-1: 1994		1.2.3.C
IPC-J-STD-004-A: 2004		REL0
IPC-J-STD-005: 1995 (powder)		T3/T4
Particle size	[µm]	25-45/20-38

Package and storage

Jar	PP [g]	500
Small cartridge	HDPE [g]	650
Big cartridge	HDPE [g]	1300
Cassette	[g]	800
Shelf life (Months)
Storage conditions	4 - 10 °C	6

Alloy	Product data sheet	Safety data sheet	Application note
S62-T3
S62-T4
S63-T3
S63-T4

Additional documentation

F3+

Solder Paste for Reflow and Vapor Phase Soldering

Classification

Package and storage

Request safety data sheet