F3+

Solder paste for reflow and vapor phase soldering

F3+ is a REL0 classified, halide-free, no-clean solder paste formulation that can be combined with many lead-free alloys.

The standard alloy SAC305 is particularly suitable for the reflow process. For higher requirements with a higher silver content, solder S9M is available. The alloys SN100C® and SCAN-Ge071 can also be used in the reflow process. The alloy SCAN-Ge071 is ideally suited for use in the vapor phase and is a silver-reduced alloy with a melting range of 217 - 224 °C to minimize tombstone effects.

Classification

DIN-EN-29454-1: 1994		1.2.3.C
IPC-J-STD-004-A: 2004		REL0
IPC-J-STD-005: 1995 (powder)		T3/T4
Particle size	[µm]	25-45/20-38

Package and storage

Jar	PP [g]	500
Small cartridge	HDPE [g]	650
Big cartridge	HDPE [g]	1300
Cassette	[g]	800
Shelf life (Months)
Storage conditions	4 - 10 °C	6

Alloy	Product data sheet	Safety data sheet	Application note
SAC305-T3
SAC305-T4
SCANGe071-T3
SCANGe071-T4
SN100C-T3
SN100C-T4
S9M-T3
S9M-T4

Additional documentation

F3+

Solder paste for reflow and vapor phase soldering

Classification

Package and storage

Request safety data sheet