Standard alloy for selective, dip and wave soldering without inert gas
The increased germanium content makes SN100CS+ particularly suitable for soldering equipment that operates in ambient applications. SN100CS+ optimizes all the features that have made SN100C® so popular. With SN100CS+, the nickel doping creates an optically shiny solder joint, which is accompanied by a significantly lower copper dissolution compared to conventional SnCu alloys. The low copper dissolution permits constant process management and reduces material consumption. Particularly the reduced tendency to dross and bridge formation due to germanium-induced lower surface tension. The anti-oxidative effect disappears at a germanium content between 0.0020 - 0.0025% and is readjusted by the addition of DESOXY RSN (SnGe1).