SN100CL

Special alloy for hot air tinning

BALVER ZINN alloy SN100CL (SnCu0,7Ni) is a lead-free special alloy for hot air tinning of printed circuit boards (HAL lead-free / LFHASL).

SN100CL is a nickel-stabilized tin-copper eutectic alloy with additional germanium doping to reduce the oxidation of the alloy. Compared to conventional SnCu alloys, it is characterized by significantly lower copper dissolution and a much finer microstructure. The special properties of SN100CL allows very planar surfaces with excellent solder ability even after several soldering processes. In contrast to galvanic applied metallization’s, HASL surfaces are resistant to aqueous alkaline cleaning of misprints in the printing process. SN100CL pad finishes are fully compatible with SAC alloys and, of course, with the high reliable SN100C®. SN100CL surface are also suitable for lead-containing applications.

Alloy composition

Element

SN100CL

SN100CLe

SN100CLe(+)

Sn

Remainder

Remainder

Remainder

Cu

0.6 - 0.7

max. 0.2

max. 0.2

Ni

0.04 - 0.06

0.04 - 0.06

0.13 - 0.17

Ge

0.005 - 0.007

0.005 - 0.007

0.005 - 0.007

Downloads

Alloy Product data sheet Safety data sheet Application note
SN100CL
SN100CLe
SN100CLe+ -