SCAN-Ge071
Standard alloy for selective and wave soldering
SCAN-Ge071 can be used for wave soldering, selective soldering and dip tinning. The nickel stabilizes the intermetallic phase in the alloy and, together with the anti-oxidative germanium, improves the poor flow properties of low-silver soldering alloys while reducing dross formation without the use of nitrogen. The alloying reduces copper dissolution and forms a homogeneous solder joints. The micro-doping improves the release of the alloy when leaving the solder wave (drain phase) and reduces the formation of bridges. Due to the micro-doping, the SCAN-Ge071 alloy is similarly reliable as the SN97C alloy.