Standard alloy or selective, dip and wave soldering
SCAN-Ge0703 can be used for wave soldering, selective soldering and dip tinning. The nickel stabilizes the intermetallic phase in the alloy and, together with the anti-oxidant germanium, improves the poor flow properties of low-silver containing alloys while reducing dross formation without the use of nitrogen. The alloy reduces copper dissolution and forms a homogeneous solder joints. The micro-doping improves the release of the alloy when leaving the solder wave (drain phase) and reduces the formation of bridges. The SCAN-Ge0703 alloy is more reliable than the SCA0703 alloy due to the micro-doping of Ni and Ge.