Balver Zinn Solder Paste XM3S
XM3S is a special solder paste formulation with No Clean flux especially made for high reliability applications such as automotive electronics. It is available with leaded and lead free powder. The product range includes SN62 and SAC3 alloys, or additional alloys on request. Since the activation system in XM3S is not aggressive we recommend soldering under nitrogen.
Physical and chemical properties
| Flux code | M3S |
| Particle size code | X |
| Alloy code SAC3 | SAC3 |
| Alloy type | Sn96.5/Ag3/Cu0.5 |
| Liquidus [°C] - SAC3 | 219 |
| Liquidus [°C] - SCAN-Ge | 217 |
| Recommended peak temp. [°C] | 232-250 |
| Particle size [m] | 25-45 |
| Oxide content powder [ppm] | 100. |
| Acid number [mgKOH] (+/-2.5%) | 60.20 |
| Halides [Potentiometric] | Pass |
| Halides [Silver-Chromate Test] | Entdeckt |
| Flux [% w/w] | 10.88 |
| Metal [% w/w] | 89.12 |
| Filmformer(s) | Synthetisches Harz |
| Color of the residue | Farblos |
| Viscosity @25 °C [Pa's] Plate/Plate (+/-18%) | 189 |
| Viscosity @ 25°C [Pa's] Malcom PCU205 (+/-18%) | 179180 |
| Max. print speed [mm/sec] | 100 |
| Rec.separation speed [mm/sec] | 10. |
| Tackiness time 20°C/ 70%RH [H] | 18 |
| Tackiness force Malcom TK1 [gr] | 110. |
| Telcordia/Bellcore TR-NWT-000078/3 | Konform |
| IPC/ANSI-J-STD-0D5 | Konform |
| Test report(s) | Available |
| Certificate of Compliance | Available |
| Environmental Load Unit 1.00 | 1.00 |
| RoHS-Compliance Certificate | Available |
| User's Guidelines | English |
| Packaging | |
| Jar (PP) [gram] | 500 |
| Small cartridge (HDPE) [gram] | 650 |
| Large cartridge (HDPE) [gram] | 1200 |
| Cassette (HDPE) [gram] | 800 |
| Shelf-life (Weeks) | |
| Storage 4-10 [°C] |
25 |
| Storage 25 [°C] | 6 |
Fields of application
| 5 | Especially made for this purpose |
| 4 | Generally qualified for this purpose |
| 3 | Generally usable, but not the best choice |
| 2 | Generally not usable for this purpose |
| 1 | Wrong choice |
| ISO 9454-1 | 1.2.2.C |
| JIS Z3284 | 1.2.3.N.II |
| IPC-ANSI-J-STD-004 (Flux) | REL1 |
| IPC-ANSI-J-STD-005 (Powder) | 3. |
| No-Clean Process | 5 |
| Post-solder cleaning | 3 |
| Pb-Free process - Air, Standard | 3 |
| Pb-Free process - Air, Extended | 4 |
| Pb-Free process - N² | 5 |
| Vapor Phase | 5 |
| Consumer electronics | 5 |
| Med-Rel electronics | 5 |
| Hi-Rel electronics | 4 |
| 1-layer, video/tv boards | - |
| 2-layer boards | - |
| Multi-layer boards | - |
| OSP compatible | 5 |
| Ni/Au compatible | 5 |
| Ni/Pd compatible | 4 |
| Ag compatible | 5 |
| Sn compatible | 5 |
| Squeegee | 5 |
| Closed Printhead (Proflow etc) | 3 |
| Dispensing [> awg 22] | 3 |
| Short cycle time | 4 |
| Long stencil-life | 5 |
| Long open time | 5 |
| Sharp print definition | 4 |
| Reduces dog ears | 4 |
| Reduces smearing | 5 |
| Reduces stencil wiping | 4 |
| Reduces solder balling | 4 |
| Reduces solder beading | 4 |
| Reduces bridging | 5 |
| Reduces tombstoning | 5 |
| Reduces de-wetting | 5 |
| Reduces slumping | 5 |
| Reduces voiding | 4 |
| Brilliant joint appearance | 3 |
| Cosmetic cleanliness | 4 |
| Reduces flux build-up in reflow oven | 4 |
| ICCT compatible | 5 |
| Conformal coating | 4 |
Data sheet download
AN_M3S-CUAG-T3(T4)_20150720_EN.pdf (354.3 KiB)
AN_M3S-S9M-T3(T4)_20150720_EN.pdf (354.2 KiB)
Chemical product, please refer to material safety data sheet before use.
