Balver Zinn Solder Paste RMA H-1 FDQ

BALVER ZINN RMA H-1 FDQ is a lead free solder paste formulation with SN100C, SN96C and SN97C alloys available. BALVER ZINN SOLDER PASTE RMA H-1 FDQ exhibits a low residue level concentrated around the pad. BALVER ZINN SOLDER PASTE RMA H-1 FDQ is a no clean formulation and the residues can safely remain on the board after reflow. The paste flux system of BALVER ZINN SOLDER PASTE RMA H-1 FDQ shows long tack life up to 24 hours. The paste flux composition allows reflow profiles with a peak temperature of 235°C - 250°C and enables a wide process window with lead free solders. BALVER ZINN RMA H-1 FDQ is also suitable for vapour phase soldering at temperatures of 230°C and 240°C.

Physical and chemical properties

Metal content: 87,5%
Malcom viscometer @ 10 rpm and 25°C
330 Pas
Initial Tackiness:
J-STD-004, IPC-TM-650, Method 2.4.44
100 gf
Slump Test:
JIS-Z-3284 Appendix 7; Appendix 8
Solder Ball Test:
J-STD-004, IPC-TM-650, Method 2.4.35
Wetting Test:
J-STD-004, IPC-TM-650, Method 2.4.45
Copper Mirror Corrosion:
J-STD-004, IPC-TM-650, Method 2.3.32
JIS-Z-3284, 85°C/85% RH, DC100V