Balver Zinn Solder Paste RMA H-1 FDQ | |||
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BALVER ZINN RMA H-1 FDQ is a lead free solder paste formulation with SN100C, SN96C and SN97C alloys available. BALVER ZINN SOLDER PASTE RMA H-1 FDQ exhibits a low residue level concentrated around the pad. BALVER ZINN SOLDER PASTE RMA H-1 FDQ is a no clean formulation and the residues can safely remain on the board after reflow. The paste flux system of BALVER ZINN SOLDER PASTE RMA H-1 FDQ shows long tack life up to 24 hours. The paste flux composition allows reflow profiles with a peak temperature of 235°C - 250°C and enables a wide process window with lead free solders. BALVER ZINN RMA H-1 FDQ is also suitable for vapour phase soldering at temperatures of 230°C and 240°C. | |||
Classification | |||
DIN EN 29454-1: 1994 | N/A | ||
IPC J-STD-004-A: 2004 | ROL1 | ||
IPC J-STD-005: 1995 | T3 | ||
Particle Size | [µm] | 25-45 | |
Test reports | |||
IPC/ANSI-J-STD-005 | Compliant | ||
Packaging and Storage | |||
Cartridge [5cc] | [g] | 20 | |
Cartridge [10cc] | [g] | 40 | |
Cartridge [30cc] | [g] | 120 | |
Cartridge [50cc] | [g] | 200 | |
Minimum shelf-live in months | |||
Storage temperature | 4-10°C | 4 |
Chemical product, please refer to material safety data sheet before use.