Balver Zinn Solder Paste RMA H-1 FDQ
BALVER ZINN RMA H-1 FDQ is a lead free solder paste formulation with SN100C, SN96C and SN97C alloys available. BALVER ZINN SOLDER PASTE RMA H-1 FDQ exhibits a low residue level concentrated around the pad. BALVER ZINN SOLDER PASTE RMA H-1 FDQ is a no clean formulation and the residues can safely remain on the board after reflow. The paste flux system of BALVER ZINN SOLDER PASTE RMA H-1 FDQ shows long tack life up to 24 hours. The paste flux composition allows reflow profiles with a peak temperature of 235°C - 250°C and enables a wide process window with lead free solders. BALVER ZINN RMA H-1 FDQ is also suitable for vapour phase soldering at temperatures of 230°C and 240°C.
DIN EN 29454-1: 1994 N/A
IPC J-STD-004-A: 2004 ROL1
IPC J-STD-005: 1995 T3
Particle Size [µm] 25-45
Test reports
IPC/ANSI-J-STD-005 Compliant
Packaging and Storage
Cartridge [5cc] [g] 20
Cartridge [10cc] [g] 40
Cartridge [30cc] [g] 120
Cartridge [50cc] [g] 200
Minimum shelf-live in months
Storage temperature 4-10°C 4

Chemical product, please refer to material safety data sheet before use.


AlloyCompositionLiquidus[°C]Product data sheetMaterial safety data sheetApplication note
SN96C T3 Sn95.5Ag3.8Cu0.7 217 Download PDF Download PDF -
SN97C T3 Sn96.5Ag3.0Cu0.5 217-219 Download PDF Download PDF -
SN100C T3 Sn99.3Cu0.7Ni 227 Download PDF Download PDF -