Balver Zinn Lead-Free Solder SN97C
BALVER ZINN SOLDER SN97C (SnAg3.0Cu0.5) is a lead-free solder that is well known in Japan. This alloy was tested extensively by the IPC and propagated as a worldwide standard solder. It is now established in Japanese electronics production. BALVER ZINN SOLDER SN97C has been developed for wave soldering, selective soldering and dip soldering applications. It is a slightly hyper- eutectic alloy with a melting range of only 1°C! BALVER ZINN SOLDER SN97Ce (SnAg3.0) is a refill alloy with a low copper content, to maintain the copper content of the solder bath within process limits. When using solders containing silver, the high copper dissolution may cause problems, particularly at higher process temperature, and small line dimensions. For such applications BALVER ZINN recommends use of the highly reliable BALVER ZINN SOLDER SN100C to reduce copper dissolution. For additional information please refer to the product data sheet.
Composition of the alloy
ElementSN97C SnAg3.0Cu0.5 in weight-%SN97Ce SnAg3.0 in weight-%
Sn Rest Rest
Ag 3.0 ± 0.2 3.0 ± 0.2
Cu 0.5 ± 0.1 max. 0.4
Ni max. 0.01 max. 0.01
Al max. 0.001 max. 0.001
As max. 0.03 max. 0.03
Bi max. 0.03 max 0.03
Cd max. 0.002 max. 0.002
Fe max. 0.02 max. 0.02
Pb max. 0.05 max. 0.05
Sb max. 0.05 max. 0.05
Zn max. 0.001 max. 0.001
Au max. 0.05 max. 0.05
In max. 0.05 max. 0.05

Chemical product, please refer to material safety data sheet before use.


AlloyTechnical data sheetMaterial safety data sheet
SN97C / SN97Ce Download PDF Download PDF