Balver Zinn Lead-Free Solder SN100CL
BALVER ZINN SOLDER SN100CL and CLe (+) are lead-free alloys, specially developed for the LFHASL process. SN100CL is chemically identical to SN100C (L stands for levelling). This alloy was rated by the NASA consortia as the most reliable lead-free alloy for wave soldering. BALVER ZINN SOLDER SN100CL is a nickel-stabilized tin copper eutectic, containing a small amount of germanium to reduce oxidation of the solder. For many years BALVER ZINN has been a market leader in the printed circuit board industry. SN100CL has been successful in the production of lead free printed circuit boards. Existing vertical and horizontal hot air levelling machines can be used or adapted for the lead free process. Another outstanding property is the bright and shiny appearance of the pre-tinned boards compared to conventional tin lead boards. BALVER ZINN SOLDER SN100CL exceeds all other lead-free alloys for lowest copper dissolution to allow profitable mass production. The specific properties of BALVER ZINN SOLDER SN100CL give outstanding co-planarity and solderability for HASL production of PCBs.
Composition of the alloy
ElementSN100CL SnCu0.7NiGe in weight-%SN100CLe SnNiGe in weight-%SN100CLe(+) SnNi0.15Ge in weight-%
Sn Rest Rest Rest
Cu 0.6 - 0.7 max. 0.2 max. 0.2
Ge 0.005 - 0.007 0.005 - 0.007 0.005 - 0.007
Ni 0.04 - 0.06 0.04 - 0.06 0.13 - 0.17
Ag max. 0.05 max 0.05 max 0.05
Al max. 0.001 max. 0.001 max. 0.001
As max. 0.03 max. 0.03 max. 0.03
Au max. 0.03 max. 0.03 max. 0.03
Bi max. 0.03 max 0.03 max 0.03
Cd max. 0.002 max. 0.002 max. 0.002
Fe max. 0.02 max. 0.02 max. 0.02
In max. 0.03 max. 0.03 max. 0.03
Pb max. 0.05 max. 0.05 max. 0.05
Sb max. 0.05 max. 0.05 max. 0.05
Zn max. 0.001 max. 0.001 max. 0.001

Chemical product, please refer to material safety data sheet before use.


AlloyTechnical data sheetMaterial safety data sheet
SN100CL / SN100CLe / SN100CLe(+) Download PDF Download PDF