Balver Zinn Lead-Free Solder SN100C®-SEL

With an increased utilization of supstrates with ENIG pad finishing and the usage of Ni covered component leads (like shielding’s) the solder composition in the selective solder bath will change. Because of lack of copper dissolution, the copper content might decrease and because of high Ni dissolution, the Ni content might increase. The BALVER ZINN SN100C®-SEL has been developed to maintain the nickel and copper concentrations in soldering applications that are sensitive for Ni and/or Cu dissolution. SN100C®-SEL stabilizes the solder bath composition because of the dedicated Ni and Cu contents in the alloy. BALVER ZINN SOLDER SN100C®-SEL is a Nickel-stabilized Tin-Copper eutectic alloy that contains traces of Germanium acting as an anti-oxidant in order to reduce the formation of solder oxides (drosses). BALVER ZINN SOLDER SN100C®-SEL creates bright and shiny solder joints which are comparable to lead-containing solders. BALVER ZINN SOLDER SN100C®-SEL, is the preferred alloy for selective soldering applications where the process temperatures can be significantly higher as with wave soldering applications. Trademarks SN100C®, SN100C®-SEL (SN100Ce®-SEL) and the patent EP1911543B1 for solder bath management are licensed from Nihon Superior.

Chemical product, please refer to material safety data sheet before use.