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Alloys
- Overview
- Bars / Solid wires
  - SN100C
  - SN100CL
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  - SCAN-Ge-Series
  - Sn63Pb37
- Solder wires
Solder pastes
- Overview
- Printing process
  - Cobar OT2
  - F3+
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  - S62-XF3+
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- Dispensing process
Fluxes / Chemistry
- Overview
- Wave soldering
  - 390-RX-HT
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  - 396-DRX-M+
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  - 95-DRX+
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  - 95-DRM
  - 95-RXZ-M
- Selective soldering
  - 385-SEL
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Balver Zinn Analysis
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BALVER ZINN
Josef Jost GmbH & Co. KG
Blintroper Weg 11
58802 Balve
Germany
Phone: (0 23 75) 915 - 0
Fax: (0 23 75) 915 - 1700
E-Mail: cia@balverzinn.com

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Solder pastes

Overview

Solder pastes

	Proposal	Pro	Contra
Vaporphase	OT2 SCAN-Ge XF3+	Large melting range Anti-Tombstoning	Dull solder joints
Nitrogen process	OT2 SAC3 XF3+ SAC3 XM3S	Standard alloy	Shiny solder joints
Air process	OT2 SAC3 XF3+ SCAN-Ge XF3+	Good wetting properties Anti-Tombstoning
Dispense Paste	RMA H-1 FDQ Sn100C SN97C SN96C	Dispense paste
Leaded process	S62 XF3+	Melting temperature	Leaded

	Lead free process	Leaded process	Dispense Lead free
High Reliability Automotive	SAC3 SCAN-Ge SN100C OT2 ROL0 SAC3 SCAN-Ge SN100C XF3+ REL0 SAC3 XM3S REL1 SN96C PF32G ROL0	REL0 S62 XF3+ REL0	Sn97C Sn100C RMA H-1 FDQ ROL1
Industrial applications
Consumer Electronics

Lead free
process

Leaded
process

Dispense
Lead free

High
Reliability
Automotive

SAC3
SCAN-Ge
SN100C
OT2
ROL0

SAC3
SCAN-Ge
SN100C
XF3+
REL0

SAC3
XM3S
REL1

SN96C
PF32G
ROL0

REL0

S62
XF3+
REL0

Sn97C
Sn100C
RMA H-1 FDQ
ROL1

Industrial
applications

Consumer

Electronics