| Balver Zinn Solder Paste 325 GM5 | |||
|---|---|---|---|
| Dispense solder paste is available in S62, and SAC405 alloy composition. The powder particle size is smaller and the flux content is higher than a standard type 3 printing solder paste to achieve the desired viscosity for dispensing applications. Because the paste is no-clean, residues can safely remain on the PCB. | |||
| Classification | |||
| DIN EN 29454-1: 1994 | N/A | ||
| IPC J-STD-004-A: 2004 | REL1 | ||
| IPC J-STD-005: 1995 | T4 | ||
| Particle Size | [µm] | 20-38 | |
| Test reports | |||
| IPC/ANSI-J-STD-005 | Compliant | ||
| Packaging and Storage | |||
| Cartridge [5cc] | [g] | 10 | |
| Cartridge [10cc] | [g] | 25 | |
| Cartridge [30cc] | [g] | 75 / 100 | |
| Cartridge [6oz] | [g] | 500 / 650 | |
| Cartridge [12oz] | [g] | 1000 / 1300 | |
| Minimum shelf-live in months | |||
| Storage temperature | 4-10°C | 4 | |
Chemical product, please refer to material safety data sheet before use.
Downloads
| Alloy | Composition | Liquidus[°C] | Product data sheet | Material safety data sheet | Application note |
|---|---|---|---|---|---|
| SAC4 T4 | Sn95.5Ag4Cu0.5 | 217 |  |
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| SN62 T4 | Sn62Pb36Ag2 | 179 | |
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