Cobar wave soldering flux 95-DRM
This low-VOC flux provides extremely powerful soldering performance and eliminates opens and bridges. This flux has been developed for use in consumer and industrial applications where residue safety is less important as soldering performance. This flux can be used without nitrogen and offers all the advantages of a low-VOC flux.
IPC J-STD-004 classification ORM0.
Physical and chemical properties
| SG @ 20 °C [kg/dm3] (+/- 0.5%) | 0.915 |
| Solids content [% w/w] | 4.00 |
| Halides [Silver-Chromate Test] | Pass |
| Halides [Potentiometric] | Pass |
| Acid number [mgKOH] (+/-2.5%) | 38.00 |
| Water content [% w/w] | 45. |
| VOC-content [% w/w] | 50.00 |
| Filmformer(s) | organic acid |
| Flashpoint COC [°C] | 23.0 |
| Odor | No |
| Color | colorless |
| Telcordia/bellcore TR-NWT-000078/3 | compliant |
| Test report(s) | - |
| Certificate of Compliance | Available |
| Environmental Load Unit | 3.75 |
| RoHS-Compliance Certificate | Available |
| User's Guidelines | English |
| Thinner | 425-00 |
| Packaging | |
| Can (HDPE) [liter] | 10 |
| Drum (HDPE) [liter] | 200 |
| Shelf-life (Weeks) | |
| Storage 20 [°C] | 40. |
| Storage 25 [°C] | 26. |
Fields of application
| 5 | Especially made for this purpose |
| 4 | Generally qualified for this purpose |
| 3 | Generally usable, but not the best choice |
| 2 | Generally not usable for this purpose |
| 1 | Wrong choice |
| ISO 9454-1 | 2.1.3.A |
| IPC-ANSI-J-STD-004 | ORM0 |
| JIS Z 3197 | 2.1.3.N_I |
| No-Clean process | 5 |
| Post-solder cleaning | 3 |
| Selective Soldering | 3 |
| Pb-Free process - Ambient | 5 |
| Pb-Free process - N² | 4 |
| N²-Process - Full Tunnel | 3 |
| N²-Process - Wave Only | 5 |
| Consumer electronics | 5 |
| Med-Rel electronics | 4 |
| Hi-Rel electronics | 3 |
| 1-layer, video/tv boards | 5 |
| 2-layer boards | 5 |
| Multi-layer boards | 5 |
| OSP compatible | 5 |
| Ni/Au compatible | 5 |
| Ni/Pd compatible | 5 |
| Ag compatible | 5 |
| Sn compatible | 5 |
| Foam fluxing | 4 |
| Nozzle-spray fluxing | 5 |
| Moderate preheat | 4 |
| Short contact time with solder | 5 |
| Reduces skipped joints | 5 |
| Reduces solder balling | 4 |
| Reduces bridging | 5 |
| Promotes wicking | 5 |
| Cosmetic cleanliness | 4 |
| Cosmetic cleanliness N2 | 4 |
| Dull/frosty joints | 2 |
| ICCT compatible | 4 |
| Conformal coating | 2 |
Data sheet download
*) Having a vapor pressure of >0.01 mm Hg @ 25°C
Industrial chemical product. Read MSDS before use.
