Cobar selective soldering flux 94-SEL
A high-reliability, low-VOC selective flux, 94-SEL contains a small percentage of DI-water to reduce spreading of the flux during the selective soldering process. Featuring optimum soldering performance and reliability, the flux is specially designed to eliminate solderballing and has numerous automotive approvals.
IPC J-STD-004 classification REL0
Physical and chemical properties
| SG @ 20 °C [kg/dm3] (+/- 0.5%) | 0.848 |
| Solids content [% w/w] | 2.57 |
| Halides [Silver-Chromate Test] | Pass |
| Halides [Potentiometric] | Pass |
| Acid number [mgKOH] (+/-2.5%) | 13.85 |
| Water content [% w/w] | 21. |
| VOC-content [% w/w] | 75.80 |
| Filmformer(s) | resin |
| Color | colorless |
| Flashpoint COC [°C] | 16.5 |
| Telcordia/bellcore TR-NWT-000078/3 | compliant |
| Test report(s) | Available |
| Certificate of Compliance | Available |
| SPC-data* | auditable |
| Environmental Load Unit | 5.20 |
| RoHS-Compliance Certificate | Available |
| User's Guidelines | English |
| Packaging | |
| Bottle (HDPE) [liter] | 1 |
| Can (HDPE) [liter] | 5, 10 |
| Thinner | 425-00 |
| Shelf-life (Weeks) | |
| Storage 20 [°C] | 40. |
| Storage 25 [°C] | 35. |
Fields of application
| 5 | Especially made for this purpose |
| 4 | Generally qualified for this purpose |
| 3 | Generally usable, but not the best choice |
| 2 | Generally not usable for this purpose |
| 1 | Wrong choice |
| ISO 9454-1 | 1.2.3.A |
| IPC-ANSI-J-STD-004 | REL0 |
| JIS Z 3197 | 1.2.3.N_I |
| No-Clean process | 5 |
| Post-solder cleaning | 3 |
| Wave Soldering | 2 |
| Pb-Free process - N² | 5 |
| Consumer electronics | 3 |
| Med-Rel electronics | 5 |
| Hi-Rel electronics | 5 |
| 1-layer, video/tv boards | 3 |
| 2-layer boards | 5 |
| Multi-layer boards | 5 |
| OSP compatible | 5 |
| Ni/Au compatible | 5 |
| Ni/Pd compatible | 4 |
| Ag compatible | 4 |
| Sn compatible | 5 |
| Bubble jet fluxing | 5 |
| Nozzle-spray fluxing | 5 |
| Template/dip fluxing | 3 |
| Hot bar soldering | 5 |
| Static solder-nozzle | 5 |
| Flow solder-nozzle | 5 |
| Short contact time with solder | 5 |
| Moderate preheat | 4 |
| Reduces spread of flux | 5 |
| Reduces solder balling | 5 |
| Reduces bridging | 4 |
| Cosmetic cleanliness | 3 |
| Cosmetic cleanliness N2 | 4 |
| ICCT compatible | 4 |
| Conformal coating | 5 |
Data sheet download
*) Having a vapor pressure of >0.01 mm Hg @ 25°C
Industrial chemical product. Read MSDS before use.
