Cobar wave soldering flux 390-RX-HT
This high-reliability flux is specifically developed for higher thermal impacts (high/long preheat with increased contact times) like in Pb-free wave soldering. The flux shows high SIR values under the most critical test conditions.
IPC J-STD-004 classification REL0
Physical and chemical properties
| SG @ 20 °C [kg/dm3] (+/- 0.5%) | 0.813 |
| Solids content [% w/w] | 2.20 |
| Halides [Silver-Chromate Test] | Pass |
| Halides [Potentiometric] | Pass |
| Acid number [mgKOH] (+/-2.5%) | 15.80 |
| Water content [% w/w] | 5. |
| VOC-content [% w/w] | 92.00 |
| Filmformer(s) | synthetic |
| Flashpoint COC [°C] | 12.4 |
| Odor | alcoholic |
| Color | colorless |
| Telcordia/bellcore TR-NWT-000078/3 | qualified |
| Test report(s) | avaiblabe |
| Certificate of Compliance | available |
| Environmental Load Unit | 6.00 |
| RoHS-Compliance Certificate | available |
| User's Guidelines | english |
| Thinner | 425-00 |
| Packaging | |
| Can (HDPE) [liter] | 10 |
| Drum (HDPE) [liter] | 200 |
| Shelf-life (Weeks) | |
| Storage 20 [°C] | 78. |
| Storage 25 [°C] | 52. |
Fields of application
| 5 | Especially made for this purpose |
| 4 | Generally qualified for this purpose |
| 3 | Generally usable, but not the best choice |
| 2 | Generally not usable for this purpose |
| 1 | Wrong choice |
| ISO 9454-1 | 1.2.3.A |
| IPC-ANSI-J-STD-004 | REL0 |
| JIS Z 3197 | 1.2.3.N_I |
| No-Clean process | 5 |
| Post-solder cleaning | 2 |
| Selective Soldering | 4 |
| Pb-Free process - Ambient | 4 |
| Pb-Free process - N² | 5 |
| N²-Process - Full Tunnel | 5 |
| N²-Process - Wave Only | 5 |
| Consumer electronics | 3 |
| Med-Rel electronics | 5 |
| Hi-Rel electronics | 5 |
| 1-layer, video/tv boards | 2 |
| 2-layer boards | 5 |
| Multi-layer boards | 5 |
| OSP compatible | 4 |
| Ni/Au compatible | 4 |
| Ni/Pd compatible | 4 |
| Ag compatible | 4 |
| Sn compatible | 5 |
| Foam fluxing | 5 |
| Nozzle-spray fluxing | 5 |
| Moderate preheat | 5 |
| Short contact time with solder | 5 |
| Reduces skipped joints | 5 |
| Reduces solder balling | 5 |
| Reduces bridging | 5 |
| Promotes wicking | 5 |
| Cosmetic cleanliness | 3 |
| Cosmetic cleanliness N2 | 4 |
| Dull/frosty joints | 3 |
| ICCT compatible | 5 |
| Conformal coating | 5 |
Data sheet download
*) Having a vapor pressure of >0.01 mm Hg @ 25°C
Industrial chemical product. Read MSDS before use.
