RMA-H1 FDQ

Lead-free solder paste for reflow and vapor phase soldering

RMA H-1 FDQ is a ROL1 classified, halide-containing no-clean solder paste formulation and can be used with or without inert gas.

RMA H-1 FDQ can be combined with the lead-free alloys SN100C®, SN97C and SN96C. Due to the special flux composition, the solder paste offers excellent properties in the printing and reflow process. The low residues are concentrated around the pad and can remain on the board after reflow. RMA H-1 FDQ has long bonding and stencil life. Reflow profiles with peak temperatures from 235°C up to 250°C can be run. For vapor phase soldering, a medium of 230°C is recommended for SN97C and SN96C alloys and 240°C for SN100C®.

Classification

DIN-EN-29454-1: 1994  

1.1.2.C
IPC-J-STD-004-A: 2004  

ROL1
IPC-J-STD-005: 1995 (powder)  

T3
Particle size

[µm]

25-45

Package and storage

Syringe [5cc]

[g]

20
Syringe [10cc]

[g]

40
Syringe [30cc]

[g]

120
Syringe [50cc]

[g]

200
Cartridge [6oz]

[g]

-
Cartridge [12oz]

[g]

-
Shelf life (Months)    
Storage conditions

4 - 10 °C

4
Alloy Safety data sheet Application note
SN97C
SN96C
SN100C

Request safety data sheet

Information on data processing can be found in our Data Protection Policy.

Additional documentation

Dispensing Applications / RMA-H1 FDQ

Legal noticeData Protection