Lead-free solder paste for reflow and vapor phase soldering
RMA H-1 FDQ can be combined with the lead-free alloys SN100C®, SN97C and SN96C. Due to the special flux composition, the solder paste offers excellent properties in the printing and reflow process. The low residues are concentrated around the pad and can remain on the board after reflow. RMA H-1 FDQ has long bonding and stencil life. Reflow profiles with peak temperatures from 235°C up to 250°C can be run. For vapor phase soldering, a medium of 230°C is recommended for SN97C and SN96C alloys and 240°C for SN100C®.
|IPC-J-STD-005: 1995 (powder)||