JEAN-151

Solder Paste for reflow and vapor phase soldering

JEAN-151 is a ROL0 classified, halide-free, no-clean solder paste formulation with improved slump to prevent bridging and bead formation.

The standard alloy SAC305 is particularly suitable for the reflow and vapour phase process. With the standard alloy, JEAN-151 is the only dispensing paste available up to grain size 5. In addition, the silver-free alloys SN100C^® can also be used in the reflow and vapour phase process.

Please feel free to send us your request.

Classification

DIN-EN-ISO-9454-1: 2016		1122
IPC-J-STD-004-A: 2004		ROL0
IPC-J-STD-005: 1995 (powder)		T4/T5
Particle size	[µm]	20-38/15-25

Package and storage

Syringe [5cc]	[g]	-
Syringe [10cc]	[g]	25/40
Syringe [30cc]	[g]	75
Syringe [50cc]	[g]	-
Cartridge [6oz]	[g]	-
Cartridge [12oz]	[g]	-
Shelf life (Months)
Storage conditions	4 - 10 °C	12

Alloy	Product data sheet	Safety data sheet	Application note
SAC305-T4
SAC305-T5
SN100C-T4

Additional documentation