JEAN-151

Solder Paste for reflow and vapor phase soldering

JEAN-151 is a ROL0 classified, halide-free, no-clean solder paste formulation with improved slump to prevent bridging and bead formation.

The standard alloy SAC305 is particularly suitable for the reflow process. With the standard alloy, JEAN-151 is the only printing paste available up to grain size 5. In addition, the silver-free, bismuth-containing solder SN100CV® is available for the highest reliability requirements. The alloys SN100C® and SCAN-Ge071 can also be used in the reflow process. Furthermore, the melting range of SCAN-Ge071 and SN100CV® alloys makes them ideal for use in the vapor phase to minimize tombstone effects.

Classification

DIN-EN-ISO-9454-1: 2016  

1122

IPC-J-STD-004-A: 2004  

ROL0

IPC-J-STD-005: 1995 (powder)  

T3/T4/T5

Particle size

[µm]

25-45/20-38/15-25

Package and storage

Jar

PP [g]

500

Small cartridge

HDPE [g]

650

Big cartridge

HDPE [g]

1300

Cassette

[g]

800

Shelf life (Months)    
Storage conditions

4 - 10 °C

12

Alloy Product data sheet Safety data sheet Application note
SAC305-T3
SAC305-T4
SAC305-T5
SCANGe071-T3
SCANGe071-T4
SN100C-T3
SN100C-T4
SN100CV-T4