JEAN-151
Solder Paste for reflow and vapor phase soldering
The standard alloy SAC305 is particularly suitable for the reflow process. With the standard alloy, JEAN-151 is the only printing paste available up to grain size 5. In addition, the silver-free, bismuth-containing solder SN100CV® is available for the highest reliability requirements. The alloys SN100C® and SCAN-Ge071 can also be used in the reflow process. Furthermore, the melting range of SCAN-Ge071 and SN100CV® alloys makes them ideal for use in the vapor phase to minimize tombstone effects.
Classification
Package and storage
| Alloy | Product data sheet | Safety data sheet | Application note |
|---|---|---|---|
| SAC305-T3 | |||
| SAC305-T4 | |||
| SAC305-T5 | |||
| SCANGe071-T3 | |||
| SCANGe071-T4 | |||
| SN100C-T3 | |||
| SN100C-T4 | |||
| SN100CV-T4 | |||
| SnBi28-T4 | - |