Lead-free solder paste for reflow soldering
GT2 can be combined with the lead-free alloys SN100C® and the standard solder SAC3. Due to the balanced activator system, the solder paste offers excellent properties in the printing and reflow process. The clear residues are concentrated around the pad and can remain on the board after reflow. The GT2 reduces typical oxidation and miniaturization problems such as graping and head-in-pillow effects. Reflow profiles can be run with peak temperatures from 232°C up to 260°C with the SAC3 and 238°C to 260°C with the SN100C®.
|IPC-J-STD-005: 1995 (powder)||