325-GM5

Leaded Solder Paste for Reflow and Vapor Phase Soldering

The 325-GM5 is a REL1 classified, halide-containing no-clean solder paste formulation and can be used with or without inert gas.

325-GM5 is solely available with solder powder S62 / T4. Reflow profiles with peak temperatures from 205°C up to 225°C can be used. For vapor phase soldering, a medium of 200°C is recommended. Since the solder paste is no-clean, residues can remain on the circuit board.

Classification

DIN-EN-29454-1: 1994  

1.2.2.C
IPC-J-STD-004-A: 2004  

REL1
IPC-J-STD-005: 1995 (powder)  

T4
Particle size

[µm]

20-38

Package and storage

Syringe [5cc]

[g]

10
Syringe [10cc]

[g]

25
Syringe [30cc]

[g]

75/100
Syringe [50cc]

[g]

-
Cartridge [6oz]

[g]

500/650
Cartridge [12oz]

[g]

1000/1300
Shelf Life (Months)    
Storage conditions

4 - 10 °C

5
Safety data sheet Application note

Request safety data sheet

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Additional documentation

Dispensing Applications / 325-GM5

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