SN100C3

SN100C3 is a non-eutectic, lead-free tin-copper alloy with 3% copper and an addition of nickel to ensure fine-grained solidification. Nickel stabilizes the intermetallic phase and reduces copper dissolution. Small amounts of germanium minimize the tendency to oxidation, even at high temperatures. Nevertheless, covering the solder bath with nitrogen is advantageous. SN100C3 is used in the component industry and in enameled copper wire tinning. Due to the copper dissolution of alloys containing high levels of tin, very thin copper wires are particularly at risk. Dipping times should therefore be kept as short as possible. SN100C4 is recommended for temperatures above 420°C.