SN100C®
Standard alloy for selective, dip and wave soldering
The nickel doping of SN100C® results in an optically shiny solder joint, which is associated with significantly lower copper dissolution compared to conventional SnCu alloy. The low copper dissolution allows constant process management and reduces material usage. Particularly noteworthy is the reduced tendency to bridge formation due to a germanium-induced lower surface tension. The anti-oxidative effect disappears at a germanium content between 0.0020 - 0.0025% and is readjusted by the addition of DESOXY RSN (SnGe1).