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The Balver Zinn Group to Supply BRILLIANT B2012 Solder Wire for the SMT IPC Hand Soldering Competition

May 09 2017

The Balver Zinn Group announces that they will sponsoring the IPC Hand Soldering Competition at SMT Hybrid Packaging in Nuremberg-Germany, scheduled to take place May 16-18, 2017. Balver Zinn will be contributing BRILLIANT B2012 solder wire which is halide-free, rosin based and designed for manual and robotic soldering.

BRILLIANT B2012 is odorless and shows excellent soldering and wetting performance. BRILLIANT B2012 is available in SN100C®, SAC305 (SN97C) and Sn63 alloys with a standard flux content of 2.2 percent. Balver Zinn wires are available in diameters from 0.3 to 3.5mm.

The IPC Hand Soldering Competition recognizes the best skills in hand soldering complex printed board assemblies. Hand soldering of high density printed boards demands highly skilled industry professionals to ensure a zero-defect soldering process.

During this competition, industry professionals will compete against each other to build a functional electronics assembly within a 60-minute time limit. Assemblies will be judged on soldering in accordance with IPC-A-610F Class 3 criteria. IPC-A-610 Master Instructors will serve as judges. The competition will be held at the IPC Hand Soldering Competition Hall 4, Booth #400.  

The Balver Zinn Group will highlight at SMT Hybrid packaging the company’s latest products, technologies and services in Hall 4, Booth #231.

Click here for your voucher for a free ticket to SMT Hybrid Packaging 2017!

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