R&D-Action - Balver Zinn

Alloys
- Overview
- Bars / Solid wires
  - SN100C
  - SN100CL
  - SN100CS+
  - SN96C
  - SN97C
  - SCAN-Ge-Series
  - Sn63Pb37
- Solder wires
Solder pastes
- Overview
- Printing process
  - Cobar OT2
  - F3+
  - XM3S
  - SP Low Melting
  - PF32G
- Dispensing process
  - RMA H-1 FDQ
  - 325GM5
Fluxes / Chemistry
- Overview
- Wave soldering
  - 390-RX-HT
  - 323-ITM
  - 385-D
  - 396-BS
  - 396-DRX+
  - 396-DRX-M+
  - 396-DRM
  - 396-QMX
  - 95-DRX+
  - 95-DRX-M+
  - 95-DRM
  - 95-RXZ-M
- Selective soldering
  - 385-SEL
  - 327-SEL
  - 94-SEL
  - 95-SEL
- Cleaners
Surface treatment
- Tin plating
- Zinc Coating
- Chrom plating anodes
  - Alloys
  - Forms
- Planar targets
Corrosion protection
Recycling
IPC / Training
Miscellaneous
Balver Zinn Analysis
- WebAccess
- Metallurgical investigations

BALVER ZINN
Josef Jost GmbH & Co. KG
Blintroper Weg 11
58802 Balve
Germany
Phone: (0 23 75) 915 - 0
Fax: (0 23 75) 915 - 1700
E-Mail: cia@balverzinn.com

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Company

R&D-Action

Collaboration with two Technical Commission of the ZVEI trade associations, PCB and Electronic Systems (PCB-ES) and Electronic Components and Systems (ECS), on technical cleanliness, and repair and rework of electronic assemblies

IGF-17405N project, DVS-No. 07 065: Effect of solder paste on the reliability of solder joints to critical ceramic SMD components on FR-4 printed circuit boards

GF project 17941N / DVS-No. 10,076: Increased reliability with micro- and low [Ag] alloy solders in electronics assembly production

IGF-17960N Project: Investigation of the influence of electrochemical corrosion on the reliability of electronic assemblies repaired using lead-free solders and no-clean flux mixtures