Cobar Solder Paste SP Low Melting
The SP series of solder paste contains low melting temperature alloys. This series also is called Intrusol because of its benefits in intrusive soldering applications. The used alloys have melting temperatures starting from 138°C. To create a high-reliability solder joint, small additions of silver are inserted. There are three standard available alloys available: Bi58 (Bi58Sn42), BSA04 (Bi57.6Sn42Ag0.4) and BSA1 (Bi57Sn42Ag1).
IPC J-STD-004 classification REL0
Physical and chemical properties
| Flux code | Intrusol XSP |
| Particle size code | T3 - X |
| Alloy code | B04 (BSA04) |
| Alloy type | BSA04: Bi57.6Sn42Ag.04 |
| Liquidus [°C] | 140 |
| Solidus | 138 |
| Recommended peak temp. [°C] | 175 |
| Particle size [m] | T3: 25-45 (X) |
| Oxide content powder [ppm] | 100 |
| Acid number [mgKOH] (+/-2.5%) | 72.2 |
| Halides [Potentiometric] | Pass |
| Halides [Silver-Chromate Test] | Pass |
| Flux [% w/w] | 10 |
| Metal [% w/w] | 89 |
| Filmformer(s) | Rosin |
| Color of the residue | Light Amber |
| Viscosity @25 °C [Pa's] Plate/Plate (+/-18%) | 126 |
| Viscosity @ 25°C [Pa's] Malcom PCU205 (+/-18%) | 116 |
| Max. print speed [mm/sec] | 80 |
| Rec.separation speed [mm/sec] | 10 |
| Tackiness time 20°C/ 70%RH [H] | - |
| Tackiness force Malcom TK1 [gr] | - |
| Telcordia/Bellcore TR-NWT-000078/3 | Compliant |
| IPC/ANSI-J-STD-0D5 | Compliant |
| Test report(s) | - |
| Certificate of Compliance | Website |
| Environmental Load Unit 1.00 | 0 |
| RoHS-Compliance Certificate | Available |
| User's Guidelines | English |
| Packaging | |
| Jar (PP) [gram] | 500 |
| Small cartridge (HDPE) [gram] | 650 |
| Large cartridge (HDPE) [gram] | 1300 |
| Cassette (HDPE) [gram] | 800 |
| Shelf-life (Weeks) | |
| Storage 4-10 [°C] | 20 |
| Storage 25 [°C] | 6 |
Fields of application
| 5 | Especially made for this purpose |
| 4 | Generally qualified for this purpose |
| 3 | Generally usable, but not the best choice |
| 2 | Generally not usable for this purpose |
| 1 | Wrong choice |
| Application | BSA04 |
| ISO 9454-1 | 1.1.3.C |
| IPC-ANSI-J-STD-004 (Flux) | ROL0 |
| IPC-ANSI-J-STD-005 (Powder) | Compliant |
| No-Clean Process | 5 |
| Post-solder cleaning | 4 |
| Pb-Free process - Air | 4 |
| Pb-Free process - N² | 4 |
| Vapor Phase | 3 |
| Consumer electronics | 5 |
| Standard industrial electronics | 4 |
| Hi-Rel electronics | 4 |
| Fine-pitch (=<0.5mm) | 5 |
| OSP compatible | 5 |
| Ni/Au compatible | 4 |
| Ni/Pd compatible | 4 |
| Ag compatible | 4 |
| Sn compatible | 5 |
| SnPb Profile Air | 4 |
| SnPb Profile N2 | 4 |
| Lead-free Profile Air, short | 3 |
| Lead-free Profile Air, long | 3 |
| Lead-free Profile N2 | 3 |
| Squeegee | 5 |
| Dispensing [> awg 22] | 2 |
| Short cycle time | 4 |
| Long stencil-life | 4 |
| Long open time | 4 |
| Sharp print definition | 5 |
| Reduces dog ears | 5 |
| Reduces smearing | 5 |
| Reduces stencil wiping | 5 |
| Reduces solder balling | 4 |
| Reduces solder beading | 4 |
| Reduces bridging | 5 |
| Reduces tombstoning | 4 |
| Reduces de-wetting | 5 |
| Reduces slumping | 5 |
| Reduces voiding | 4 |
| Brilliant joint appearance | 5 |
| Cosmetic cleanliness | 5 |
| Reduces flux build-up in reflow oven | 4 |
| ICCT compatible | 5 |
| Conformal coating | 5 |
Data sheet download
Chemical product, please refer to material safety data sheet before use.
