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Cobar Solder Paste SP Low Melting

The SP series of solder paste contains low melting temperature alloys. This series also is called Intrusol because of its benefits in intrusive soldering applications. The used alloys have melting temperatures starting from 138°C. To create a high-reliability solder joint, small additions of silver are inserted. There are three standard available alloys available: Bi58 (Bi58Sn42), BSA04 (Bi57.6Sn42Ag0.4) and BSA1 (Bi57Sn42Ag1).

IPC J-STD-004 classification REL0

Physical and chemical properties

Flux code Intrusol XSP
Particle size code T3 - X
Alloy code B04 (BSA04)
Alloy type BSA04: Bi57.6Sn42Ag.04
Liquidus [°C] 140
Solidus 138
Recommended peak temp. [°C] 175
Particle size [m] T3: 25-45 (X)
Oxide content powder [ppm] 100
Acid number [mgKOH] (+/-2.5%) 72.2
Halides [Potentiometric] Pass
Halides [Silver-Chromate Test] Pass
Flux [% w/w] 10
Metal [% w/w] 89
Filmformer(s) Rosin
Color of the residue Light Amber
Viscosity @25 °C [Pa's] Plate/Plate (+/-18%) 126
Viscosity @ 25°C [Pa's] Malcom PCU205 (+/-18%) 116
Max. print speed [mm/sec] 80
Rec.separation speed [mm/sec] 10
Tackiness time 20°C/ 70%RH [H] -
Tackiness force Malcom TK1 [gr] -
Telcordia/Bellcore TR-NWT-000078/3 Compliant
IPC/ANSI-J-STD-0D5 Compliant
Test report(s) -
Certificate of Compliance Website
Environmental Load Unit 1.00 0
RoHS-Compliance Certificate Available
User's Guidelines English
Jar (PP) [gram] 500
Small cartridge (HDPE) [gram] 650
Large cartridge (HDPE) [gram] 1300
Cassette (HDPE) [gram] 800
Shelf-life (Weeks)  
Storage 4-10 [°C] 20
Storage 25 [°C] 6

Fields of application

5 Especially made for this purpose
4 Generally qualified for this purpose
3 Generally usable, but not the best choice
2 Generally not usable for this purpose
1 Wrong choice
Application BSA04
ISO 9454-1 1.1.3.C
IPC-ANSI-J-STD-004 (Flux) ROL0
IPC-ANSI-J-STD-005 (Powder) Compliant
No-Clean Process 5
Post-solder cleaning 4
Pb-Free process - Air 4
Pb-Free process - N² 4
Vapor Phase 3
Consumer electronics 5
Standard industrial electronics 4
Hi-Rel electronics 4
Fine-pitch (=<0.5mm) 5
OSP compatible 5
Ni/Au compatible 4
Ni/Pd compatible 4
Ag compatible 4
Sn compatible 5
SnPb Profile Air 4
SnPb Profile N2 4
Lead-free Profile Air, short 3
Lead-free Profile Air, long 3
Lead-free Profile N2 3
Squeegee 5
Dispensing [> awg 22] 2
Short cycle time 4
Long stencil-life 4
Long open time 4
Sharp print definition 5
Reduces dog ears 5
Reduces smearing 5
Reduces stencil wiping 5
Reduces solder balling 4
Reduces solder beading 4
Reduces bridging 5
Reduces tombstoning 4
Reduces de-wetting 5
Reduces slumping 5
Reduces voiding 4
Brilliant joint appearance 5
Cosmetic cleanliness 5
Reduces flux build-up in reflow oven 4
ICCT compatible 5
Conformal coating 5

Chemical product, please refer to material safety data sheet before use.