Balver Zinn Solder Paste XM3S

XM3S is a special solder paste formulation with No Clean flux especially made for high reliability applications such as automotive electronics. It is available with leaded and lead free powder. The product range includes SN62 and SAC3 alloys, or additional alloys on request. Since the activation system in XM3S is not aggressive we recommend soldering under nitrogen.

Physical and chemical properties

Flux code M3S
Particle size code X
Alloy code SAC3 SAC3
Alloy type Sn96.5/Ag3/Cu0.5
Liquidus [°C] - SAC3 219
Liquidus [°C] - SCAN-Ge 217
Recommended peak temp. [°C] 232-250
Particle size [m] 25-45
Oxide content powder [ppm] 100.
Acid number [mgKOH] (+/-2.5%) 60.20
Halides [Potentiometric] Pass
Halides [Silver-Chromate Test] Entdeckt
Flux [% w/w] 10.88
Metal [% w/w] 89.12
Filmformer(s) Synthetisches Harz
Color of the residue Farblos
Viscosity @25 °C [Pa's] Plate/Plate (+/-18%) 189
Viscosity @ 25°C [Pa's] Malcom PCU205 (+/-18%) 179180
Max. print speed [mm/sec] 100
Rec.separation speed [mm/sec] 10.
Tackiness time 20°C/ 70%RH [H] 18
Tackiness force Malcom TK1 [gr] 110.
Telcordia/Bellcore TR-NWT-000078/3 Konform
IPC/ANSI-J-STD-0D5 Konform
Test report(s) Available
Certificate of Compliance Available
Environmental Load Unit 1.00 1.00
RoHS-Compliance Certificate Available
User's Guidelines English
Packaging  
Jar (PP) [gram] 500
Small cartridge (HDPE) [gram] 650
Large cartridge (HDPE) [gram] 1200
Cassette (HDPE) [gram] 800
Shelf-life (Weeks)  
Storage 4-10 [°C]
25
Storage 25 [°C] 6

Fields of application

5 Especially made for this purpose
4 Generally qualified for this purpose
3 Generally usable, but not the best choice
2 Generally not usable for this purpose
1 Wrong choice
ISO 9454-1 1.2.2.C
JIS Z3284 1.2.3.N.II
IPC-ANSI-J-STD-004 (Flux) REL1
IPC-ANSI-J-STD-005 (Powder) 3.
No-Clean Process 5
Post-solder cleaning 3
Pb-Free process - Air, Standard 3
Pb-Free process - Air, Extended 4
Pb-Free process - N² 5
Vapor Phase 5
Consumer electronics 5
Med-Rel electronics 5
Hi-Rel electronics 4
1-layer, video/tv boards -
2-layer boards -
Multi-layer boards -
OSP compatible 5
Ni/Au compatible 5
Ni/Pd compatible 4
Ag compatible 5
Sn compatible 5
Squeegee 5
Closed Printhead (Proflow etc) 3
Dispensing [> awg 22] 3
Short cycle time 4
Long stencil-life 5
Long open time 5
Sharp print definition 4
Reduces dog ears 4
Reduces smearing 5
Reduces stencil wiping 4
Reduces solder balling 4
Reduces solder beading 4
Reduces bridging 5
Reduces tombstoning 5
Reduces de-wetting 5
Reduces slumping 5
Reduces voiding 4
Brilliant joint appearance 3
Cosmetic cleanliness 4
Reduces flux build-up in reflow oven 4
ICCT compatible 5
Conformal coating 4

Chemical product, please refer to material safety data sheet before use.