Balver Zinn Solder Paste XF3+
The SCAN-Ge071-XF3+ is a halide free no clean lead-free solder paste. Available alloys are SN62; SN100C; SCAN-Ge071; SAC3. The SCANGe071 is a low silver alloy with a large melting range (which makes it very suitable for vapour phase applications). SCAN-Ge071 stands for Sn0.7Cu1.0AgNiGe with powder type 3. The low level of Ag improves the wetting; Ni and Ge micro alloying results in fine grain structures and minimizes intermetallic growth. See the Product Data Sheet (PDS) for the technical data of this product. An up to date version of the PDS for most current products is available through our website at http://www.cobar.com See the Material Safety Data Sheet (MSDS) before handling and/or using this product.
Physical and chemical properties
| Flux code | F3+ |
| Particle size code | X |
| Alloy code SAC3 | SAC3 |
| Alloy type | Sn96.5/Ag3/Cu0.5 |
| Liquidus [°C] - SAC3 | 219 |
| Liquidus [°C] - SCAN-Ge | 217 |
| Recommended peak temp. [°C] | 232-250 |
| Particle size [m] | 25-45 |
| Oxide content powder [ppm] | 100. |
| Acid number [mgKOH] (+/-2.5%) | 124.30 |
| Halides [Potentiometric] | Pass |
| Halides [Silver-Chromate Test] | Pass |
| Flux [% w/w] | 12.00 |
| Metal [% w/w] | 88.00 |
| Filmformer(s) | Synthetisches Harz |
| Color of the residue | Farblos |
| Viscosity @25 °C [Pa's] Plate/Plate (+/-18%) | 190 |
| Viscosity @ 25°C [Pa's] Malcom PCU205 (+/-18%) | 180 |
| Max. print speed [mm/sec] | 100 |
| Rec.separation speed [mm/sec] | 10. |
| Tackiness time 20°C/ 70%RH [H] | 24. |
| Tackiness force Malcom TK1 [gr] | 110. |
| Telcordia/Bellcore TR-NWT-000078/3 | Konform |
| IPC/ANSI-J-STD-0D5 | Konform |
| Test report(s) | Available |
| Certificate of Compliance | Available |
| Environmental Load Unit 1.00 | 1.00 |
| RoHS-Compliance Certificate | Available |
| User's Guidelines | English |
| Packaging | |
| Jar (PP) [gram] | 500 |
| Small cartridge (HDPE) [gram] | 650 |
| Large cartridge (HDPE) [gram] | 1200 |
| Cassette (HDPE) [gram] | 800 |
| Shelf-life (Weeks) | |
| Storage 4-10 [°C] |
25 |
| Storage 25 [°C] | 6 |
Fields of application
| 5 | Especially made for this purpose |
| 4 | Generally qualified for this purpose |
| 3 | Generally usable, but not the best choice |
| 2 | Generally not usable for this purpose |
| 1 | Wrong choice |
| Application | SCAN-Ge | SAC3 |
| ISO 9454-1 | 1.2.3.C | 1.2.3.C |
| JIS Z3284 | 1.2.3.N_1 | 1.2.3.N_1 |
| IPC-ANSI-J-STD-004 (Flux) | REL0 | REL0 |
| IPC-ANSI-J-STD-005 (Powder) | 3. | 3. |
| No-Clean Process | 5 | 5 |
| Post-solder cleaning | 3 | 3 |
| Pb-Free process - Air, Standard | 3 | 5 |
| Pb-Free process - Air, Extended | 4 | 4 |
| Pb-Free process - N² | 5 | 5 |
| Vapor Phase | 5 | 4 |
| Consumer electronics | 5 | 5 |
| Med-Rel electronics | 5 | 5 |
| Hi-Rel electronics | 4 | 4 |
| 1-layer, video/tv boards | - | - |
| 2-layer boards | - | - |
| Multi-layer boards | - | - |
| OSP compatible | 5 | 5 |
| Ni/Au compatible | 5 | 5 |
| Ni/Pd compatible | 4 | 4 |
| Ag compatible | 5 | 5 |
| Sn compatible | 5 | 5 |
| Squeegee | 5 | 5 |
| Closed Printhead (Proflow etc) | 3 | 3 |
| Dispensing [> awg 22] | 3 | 3 |
| Short cycle time | 4 | 5 |
| Long stencil-life | 5 | 5 |
| Long open time | 5 | 5 |
| Sharp print definition | 4 | 4 |
| Reduces dog ears | 4 | 4 |
| Reduces smearing | 5 | 4 |
| Reduces stencil wiping | 4 | 4 |
| Reduces solder balling | 4 | 4 |
| Reduces solder beading | 4 | 5 |
| Reduces bridging | 5 | 5 |
| Reduces tombstoning | 5 | 4 |
| Reduces de-wetting | 5 | 5 |
| Reduces slumping | 5 | 5 |
| Reduces voiding | 4 | 5 |
| Brilliant joint appearance | 3 | 4 |
| Cosmetic cleanliness | 4 | 4 |
| Reduces flux build-up in reflow oven | 4 | 4 |
| ICCT compatible | 5 | 5 |
| Conformal coating | 4 | 4 |
Data sheet download
Application note SCAN-Ge071-XF3+.pdf (83.0 kB)
Chemical product, please refer to material safety data sheet before use.
