Balver Zinn Solder Paste RMA6-FMQ

BALVER ZINN SOLDERPASTE RMA 6 FMQ SN62 is a tin-lead, silver containing solder paste based on Sn62Pb36Ag2 with a melting temperature of 179°C. BALVER ZINN SOLDERPASTE RMA 6 FMQ SN62 can be used for air or nitrogen reflow applications and gives excellent print and reflow characteristics. BALVER ZINN SOLDERPASTE RMA 6 FMQ SN62 exhibits a low residue level concentrated around the pad. BALVER ZINN SOLDERPASTE RMA 6 FMQ SN62 is a no clean formulation. The residues can safely remain on the board after reflow and will not interfere in service. The paste flux compositions allows reflow profiles with a peak temperature of 215°C - 235°C and allows a wide process window.

Physical and chemical properties

Viscosity:
Malcom viscometer @ 10 rpm and 25°C
185 Pas
Initial Tackiness:
J-STD-004, IPC-TM-650, Method 2.4.44
100 gf
Slump Test:
JIS-Z-3284 Appendix 7; Appendix 8
pass
Solder Ball Test:
J-STD-004, IPC-TM-650, Method 2.4.35
pass
Wetting Test:
J-STD-004, IPC-TM-650, Method 2.4.45
pass
Thixotropie Index: 0,57
Copper Mirror Corrosion:
J-STD-004, IPC-TM-650, Method 2.3.32
low
Silver Chromate Test:
J-STD-004, IPC-TM-650, Methode 2.3.33
pass
Chlorides and Bromides:
J-STD-004, IPC-TM-650, Methode 2.3.35
0,045 %
Corrosion Test:
J-STD-004, IPC-TM-650, Methode 2.6.15
low
Fluoride by Spot Test:
J-STD-004, IPC-TM-650, Methode 2.3.35.1
pass
SIR, IPC:
JIS-Z-3284, 85°C/85% RH, DC100V
pass

Product Properties

  • Flux classified according to J-STD-004 as: ROL1
  • Paste classified according to EN 61190 -1-2: ROL1
  • Bright and shiny solder joints Long tack time.
  • Excellent print results with 16 and 20 mils pitch.

Electrochemical migration: Passed

  Blank RMA-6 FMQ
Day 1 1,6 x 10 1,5 x 10
Day 4 9,4 x 10 1,0 x 10
Day 7 8,4 x 10 1,0 x 10