Balver Zinn Solder Paste RMA H-1 FDQ
BALVER ZINN RMA H-1 FDQ is a lead free solder paste formulation with SN100C, SN96C and SN97C alloys available. BALVER ZINN SOLDER PASTE RMA H-1 FDQ exhibits a low residue level concentrated around the pad. BALVER ZINN SOLDER PASTE RMA H-1 FDQ is a no clean formulation and the residues can safely remain on the board after reflow. The paste flux system of BALVER ZINN SOLDER PASTE RMA H-1 FDQ shows long tack life up to 24 hours. The paste flux composition allows reflow profiles with a peak temperature of 235°C - 250°C and enables a wide process window with lead free solders. BALVER ZINN RMA H-1 FDQ is also suitable for vapour phase soldering at temperatures of 230°C and 240°C.
Data sheet download
Solderpaste RMA H-1 FDQ.pdf (138.7 kB)
Physical and chemical properties
| Metal content: | 87,5% |
| Viscosity: Malcom viscometer @ 10 rpm and 25°C |
330 Pas |
| Initial Tackiness: J-STD-004, IPC-TM-650, Method 2.4.44 |
100 gf |
| Slump Test: JIS-Z-3284 Appendix 7; Appendix 8 |
pass |
| Solder Ball Test: J-STD-004, IPC-TM-650, Method 2.4.35 |
pass |
| Wetting Test: J-STD-004, IPC-TM-650, Method 2.4.45 |
pass |
| Copper Mirror Corrosion: J-STD-004, IPC-TM-650, Method 2.3.32 |
pass |
| SIR, IPC: JIS-Z-3284, 85°C/85% RH, DC100V |
pass |
