Balver Zinn Solder Paste PF32G

BALVER ZINN SOLDER PASTE PF32G FMQ SN96C is a lead-free, no clean, solder paste for air or nitrogen reflow applications. The unique flux composition of BALVER ZINN SOLDER PASTE PF32G FMQ SN96C gives excellent print and reflow characteristics with lead-free alloys. Print speeds can be achieved up to 150mm/s with excellent characteristics down to 16-20 mils pitch. The residues of BALVER ZINN SOLDER PASTE PF32G FMQ SN96C are very low and concentrated around the pad. BALVER ZINN SOLDER PASTE PF32G FMQ SN96C is a no clean formulation. The residues are safe and can remain on the board after reflow. The paste flux system of BALVER ZINN SOLDER PASTE PF32G FMQ SN96C shows long tack life up to 24 hours and long stencil life up to 8 hours. The paste flux composition allows reflow profiles with a peak temperature of 235°C - 250°C and enables a wide process window with lead free solders. BALVER ZINN SOLDER PASTE PF32G FMQ SN96C is also suitable for vapour phase soldering at temperatures over 230°C and is available with a licensed lead free alloy, SN96C-SnAg3,8Cu0,7 (JPN 3027441; US 5527628).

Physical and chemical properties

Metal content: 86-89%
Viscosity:
Malcom viscometer @ 10 rpm and 25°C
185 Pas
Initial Tackiness:
J-STD-004, IPC-TM-650, Method 2.4.44
138 gf
Slump Test:
JIS-Z-3284 Appendix 7; Appendix 8
pass
Solder Ball Test:
JIS-Z-3284 Appendix 11
pass
Wetting Test:
JIS-Z-3284 Appendix 10
pass
Copper Plate Corrosion:
JIS-Z-3197 6.6.1
pass
SIR, IPC:
J-STD-004, IPC-TM-650, Method 2.6.3.3
pass