Balver Zinn Solder Paste PF32G
BALVER ZINN SOLDER PASTE PF32G FMQ SN96C is a lead-free, no clean, solder paste for air or nitrogen reflow applications. The unique flux composition of BALVER ZINN SOLDER PASTE PF32G FMQ SN96C gives excellent print and reflow characteristics with lead-free alloys. Print speeds can be achieved up to 150mm/s with excellent characteristics down to 16-20 mils pitch. The residues of BALVER ZINN SOLDER PASTE PF32G FMQ SN96C are very low and concentrated around the pad. BALVER ZINN SOLDER PASTE PF32G FMQ SN96C is a no clean formulation. The residues are safe and can remain on the board after reflow. The paste flux system of BALVER ZINN SOLDER PASTE PF32G FMQ SN96C shows long tack life up to 24 hours and long stencil life up to 8 hours. The paste flux composition allows reflow profiles with a peak temperature of 235°C - 250°C and enables a wide process window with lead free solders. BALVER ZINN SOLDER PASTE PF32G FMQ SN96C is also suitable for vapour phase soldering at temperatures over 230°C and is available with a licensed lead free alloy, SN96C-SnAg3,8Cu0,7 (JPN 3027441; US 5527628).
Classification
DIN EN 29454-1: 1994 N/A
IPC J-STD-004-A: 2004 ROL0
IPC J-STD-005: 1995 T3 / T4
Particle Size [µm] 25-45 / 20-38
Test reports
IPC/ANSI-J-STD-005 Compliant
Packaging and Storage
Packaging jar [g] 500
Packaging cartridge [g] 650
Packaging cartridge [g] 1300
Packaging Cassette Pro-Flow [g] 800
Minimum shelf-live in months
Storage temperature 4-10°C 6

Chemical product, please refer to material safety data sheet before use.

Downloads

AlloyCompositionLiquidus[°C]Product data sheetMaterial safety data sheetApplication note
SN96C T3 Sn95.5Ag3.8Cu0.7 217 Download PDF Download PDF -
SN96C T4 Sn95.5Ag3.8Cu0.7 217 Download PDF Download PDF -