Balver Zinn Solder Paste Cobar OT2

Cobar OT2 is the latest paste technology that is specially developed to meet continuously increasing customer requirements.

The OT2 solder paste’s optimized rosin based chemistry offers the best printing and wetting properties in Pb-free as well as SnPb. Because of the uniform paste flux technology for SnPb and Pb-free, it is easy to switch from SnPb to Pb-free. The solder paste is designed to achieve printing speeds up to 250 mm/s for the most demanding throughputs. The combination of solvents and activators used in this paste returns a large process window for the reflow process. High yields can be achieved with fast conveyor speeds and short cycle times.

Cobar OT2 solder paste halogen and halide-free, is available with low-cost alloys such as SN100C and SCANGe-071. These solder pastes have no or low silver contents and are ideal for cost driven markets, but Cobar OT2 is also available in SAC305. Due to its outstanding activation system, the paste eliminates Head-in-Pillow defects that are critical in lead-free soldering of BGAs. Even with the smallest components, such as 01005 or 0201, this paste does not show graping or other defects. It provides perfect wetting conditions for the most reliable solder joints.

Physical and chemical properties

Flux code COBAR OT2
Particle size code Klasse 3
Alloy code SAC3 SCAN-Ge / SAC3
Alloy type Diverse
Liquidus [°C] - SAC3 217 - 219
Liquidus [°C] - SCAN-Ge 217 - 224
Recommended peak temp. [°C] 230 - 245
Particle size [m] 24 - 45
Oxide content powder [ppm] 100.
Acid number [mgKOH] (+/-2.5%) 60.60
Halides [Potentiometric] Pass
Halides [Silver-Chromate Test] Pass
Flux [% w/w] 12.00
Metal [% w/w] 88.00
Filmformer(s) Harz
Color of the residue No
Viscosity @25 °C [Pa's] Plate/Plate (+/-18%) 220.
Viscosity @ 25°C [Pa's] Malcom PCU205 (+/-18%) 210.
Max. print speed [mm/sec] 200.
Rec.separation speed [mm/sec] 10.
Tackiness time 20°C/ 70%RH [H] 24.
Tackiness force Malcom TK1 [gr] 100.
Telcordia/Bellcore TR-NWT-000078/3 Konform
IPC/ANSI-J-STD-0D5 Konform
Test report(s) -
Certificate of Compliance Available
Environmental Load Unit 1.00 0
RoHS-Compliance Certificate Available
User's Guidelines English
Packaging  
Jar (PP) [gram] 500
Small cartridge (HDPE) [gram] 600
Large cartridge (HDPE) [gram] 1200
Cassette (HDPE) [gram] 800
Shelf-life (Weeks)  
Storage 4-10 [°C] 25
Storage 25 [°C] 6

Fields of application

5 Especially made for this purpose
4 Generally qualified for this purpose
3 Generally usable, but not the best choice
2 Generally not usable for this purpose
1 Wrong choice
Application SCAN-Ge SAC3
ISO 9454-1 1.1.3.C 1.1.3.C
JIS Z3284 ROL0 ROL0
IPC-ANSI-J-STD-004 (Flux)    
IPC-ANSI-J-STD-005 (Powder) 3. 3.
No-Clean Process 5 5
Post-solder cleaning 3 3
Pb-Free process - Air, Standard 5 5
Pb-Free process - Air, Extended 5 5
Pb-Free process - N² 5 5
Vapor Phase 5 4
Consumer electronics 5 5
Med-Rel electronics 5 5
Hi-Rel electronics 5 5
1-layer, video/tv boards 5 5
2-layer boards 5 5
Multi-layer boards 5 5
OSP compatible 5 5
Ni/Au compatible 5 5
Ni/Pd compatible 4 4
Ag compatible 4 4
Sn compatible 5 5
Squeegee 4 4
Closed Printhead (Proflow etc) 3 3
Dispensing [> awg 22] 1 1
Short cycle time 2 1
Long stencil-life 5 5
Long open time 5 5
Sharp print definition 5 5
Reduces dog ears 5 5
Reduces smearing 5 5
Reduces stencil wiping 5 5
Reduces solder balling 4 4
Reduces solder beading 4 4
Reduces bridging 5 5
Reduces tombstoning 5 4
Reduces de-wetting 5 5
Reduces slumping 5 5
Reduces voiding 4 4
Brilliant joint appearance 5 5
Cosmetic cleanliness 5 5
Reduces flux build-up in reflow oven 3 3
ICCT compatible 5 5
Conformal coating 5 5

Chemical product, please refer to material safety data sheet before use.