Balver Zinn Solder Paste Cobar OT2
Cobar OT2 is halogen and halide-free, and is available with low-cost alloys such as SN100C and SCANGe-071. These solder pastes have no or low silver contents and are ideal for cost driven markets, but Cobar OT2 is also available in SAC305. The rosin-based flux medium enables printing at very high speeds (>200 mm/sec). Due to its outstanding activation system, the paste eliminates Head-in-Pillow defects that are critical in lead-free soldering of BGAs. Even with the smallest components, such as 01005 or 0201, this paste does not show graping or other defects. It provides perfect wetting conditions for the most reliable solder joints.
Physical and chemical properties
| Flux code | COBAR OT2 |
| Particle size code | Klasse 3 |
| Alloy code SAC3 | SCAN-Ge / SAC3 |
| Alloy type | Diverse |
| Liquidus [°C] - SAC3 | 217 - 219 |
| Liquidus [°C] - SCAN-Ge | 217 - 224 |
| Recommended peak temp. [°C] | 230 - 245 |
| Particle size [m] | 24 - 45 |
| Oxide content powder [ppm] | 100. |
| Acid number [mgKOH] (+/-2.5%) | 60.60 |
| Halides [Potentiometric] | Pass |
| Halides [Silver-Chromate Test] | Pass |
| Flux [% w/w] | 12.00 |
| Metal [% w/w] | 88.00 |
| Filmformer(s) | Harz |
| Color of the residue | No |
| Viscosity @25 °C [Pa's] Plate/Plate (+/-18%) | 220. |
| Viscosity @ 25°C [Pa's] Malcom PCU205 (+/-18%) | 210. |
| Max. print speed [mm/sec] | 200. |
| Rec.separation speed [mm/sec] | 10. |
| Tackiness time 20°C/ 70%RH [H] | 24. |
| Tackiness force Malcom TK1 [gr] | 100. |
| Telcordia/Bellcore TR-NWT-000078/3 | Konform |
| IPC/ANSI-J-STD-0D5 | Konform |
| Test report(s) | - |
| Certificate of Compliance | Available |
| Environmental Load Unit 1.00 | 0 |
| RoHS-Compliance Certificate | Available |
| User's Guidelines | English |
| Packaging | |
| Jar (PP) [gram] | 500 |
| Small cartridge (HDPE) [gram] | 600 |
| Large cartridge (HDPE) [gram] | 1200 |
| Cassette (HDPE) [gram] | 800 |
| Shelf-life (Weeks) | |
| Storage 4-10 [°C] |
25 |
| Storage 25 [°C] | 6 |
Fields of application
| 5 | Especially made for this purpose |
| 4 | Generally qualified for this purpose |
| 3 | Generally usable, but not the best choice |
| 2 | Generally not usable for this purpose |
| 1 | Wrong choice |
| Application | SCAN-Ge | SAC3 |
| ISO 9454-1 | 1.1.3.C | 1.1.3.C |
| JIS Z3284 | ROL0 | ROL0 |
| IPC-ANSI-J-STD-004 (Flux) | ||
| IPC-ANSI-J-STD-005 (Powder) | 3. | 3. |
| No-Clean Process | 5 | 5 |
| Post-solder cleaning | 3 | 3 |
| Pb-Free process - Air, Standard | 5 | 5 |
| Pb-Free process - Air, Extended | 5 | 5 |
| Pb-Free process - N² | 5 | 5 |
| Vapor Phase | 5 | 4 |
| Consumer electronics | 5 | 5 |
| Med-Rel electronics | 5 | 5 |
| Hi-Rel electronics | 5 | 5 |
| 1-layer, video/tv boards | 5 | 5 |
| 2-layer boards | 5 | 5 |
| Multi-layer boards | 5 | 5 |
| OSP compatible | 5 | 5 |
| Ni/Au compatible | 5 | 5 |
| Ni/Pd compatible | 4 | 4 |
| Ag compatible | 4 | 4 |
| Sn compatible | 5 | 5 |
| Squeegee | 4 | 4 |
| Closed Printhead (Proflow etc) | 3 | 3 |
| Dispensing [> awg 22] | 1 | 1 |
| Short cycle time | 2 | 1 |
| Long stencil-life | 5 | 5 |
| Long open time | 5 | 5 |
| Sharp print definition | 5 | 5 |
| Reduces dog ears | 5 | 5 |
| Reduces smearing | 5 | 5 |
| Reduces stencil wiping | 5 | 5 |
| Reduces solder balling | 4 | 4 |
| Reduces solder beading | 4 | 4 |
| Reduces bridging | 5 | 5 |
| Reduces tombstoning | 5 | 4 |
| Reduces de-wetting | 5 | 5 |
| Reduces slumping | 5 | 5 |
| Reduces voiding | 4 | 4 |
| Brilliant joint appearance | 5 | 5 |
| Cosmetic cleanliness | 5 | 5 |
| Reduces flux build-up in reflow oven | 3 | 3 |
| ICCT compatible | 5 | 5 |
| Conformal coating | 5 | 5 |
Data sheet download
Chemical product, please refer to material safety data sheet before use.
