Balver Zinn solder SN97C

BALVER ZINN SOLDER SN97C (SnAg3.0Cu0.5) is a lead-free solder that is well known in Japan. This alloy was tested extensively by the IPC and propagated as a worldwide standard solder. It is now established in Japanese electronics production. BALVER ZINN SOLDER SN97C has been developed for wave soldering, selective soldering and dip soldering applications. It is a slightly hyper- eutectic alloy with a melting range of only 1°C! BALVER ZINN SOLDER SN97Ce (SnAg3.0) is a refill alloy with a low copper content, to maintain the copper content of the solder bath within process limits. When using solders containing silver, the high copper dissolution may cause problems, particularly at higher process temperature, and small line dimensions. For such applications BALVER ZINN recommends use of the highly reliable BALVER ZINN SOLDER SN100C to reduce copper dissolution. For additional information please refer to the product data sheet.

Composition of the alloy

Element SN97C
SnAg3,0Cu0,5
in weight-%
SN97Ce
SnAg3,0
in weight-%
Sn Rest Rest
Ag 3,0 ± 0,2 3,0 ± 0,2
Cu 0,5 ± 0,1 max. 0,4
Ni max. 0,01 max. 0,01
Al max. 0,001 max. 0,001
As max. 0,03 max. 0,03
Bi max. 0,03 max. 0,03
Cd max. 0,002 max. 0,002
Fe max. 0,02 max. 0,02
Pb max. 0,05 max. 0,05
Sb max. 0,05 max. 0,05
Zn max. 0,001 max. 0,001
Au max. 0,05 max. 0,05
In max. 0,05 max. 0,05