Balver Zinn i-SAC solder family
BALVER ZINN, the specialist for micro – alloyed solder presents the new tin silver based i-SAC solder family. The solidification characteristics of silver containing alloys have been upgraded by addition of Cobalt (Co). BALVER ZINN i-SAC105 (silver contents on request between 0.5 – 1.5%) combines the advantages of silver free alloys with the benefits of silver containing alloys such as, for example, SnAg3.0Cu0.5: low price, bright and shiny solder joints and fine grained microstructure. Cobalt in i-SAC-Series is responsible for a homogenous microstructure in comparison to standard SnAg alloys! In the i-SAC formulations Ge plays the role of antioxidant, preferentially reacting with oxygen to protect the solder from the oxidation that results in the formation of dross. BALVER ZINN SOLDERS i-SAC105; i-SAC205; i-SAC305; i-SAC387 are part of the new micro – alloyed lead free solder range based on SnAg. For additional information please refer to the product data sheet.
Composition of the alloy
| Element | i-SAC305 SnAg3,0Cu0,5CoGe in weight-% |
i-SAC300 SnAg3,0CoGe in weight-% |
|---|---|---|
| Sn | Rest | Rest |
| Ag | 3,0 ± 0,2 | 3,0 ± 0,2 |
| Cu | 0,5 ± 0,1 | max. 0,2 |
| Co | 0,045 ± 0,005 | 0,045 ± 0,005 |
| Ge | 0,0045 ± 0,0005 | 0,0045 ± 0,0005 |
| Ni | max. 0,01 | max. 0,01 |
| Al | max. 0,001 | max. 0,001 |
| As | max. 0,03 | max. 0,03 |
| Au | max. 0,03 | max. 0,03 |
| Bi | max. 0,03 | max. 0,03 |
| Cd | max. 0,002 | max. 0,002 |
| Fe | max. 0,02 | max. 0,02 |
| In | max. 0,03 | max. 0,03 |
| Pb | max. 0,05 | max. 0,05 |
| Sb | max. 0,05 | max. 0,05 |
| Zn | max. 0,001 | max. 0,001 |
