Cobar wave soldering flux 396-DRX+

VOC-free, low solids flux that provides extremely low residues. Using this flux requires the minimum of a nitrogen atmosphere on the wave.

IPC J-STD-004 classification ORL0

Physical and chemical properties

SG @ 20 °C [kg/dm3] (+/- 0.5%) 1.007
Solids content [% w/w] 2.40
Halides [Silver-Chromate Test] Pass
Halides [Potentiometric] Pass
Acid number [mgKOH] (+/-2.5%) 22.20
Water content [% w/w] 97.
VOC-content [% w/w] -
Filmformer(s) organic acid
Flashpoint COC [°C] -
Odor No
Color colorless
Telcordia/bellcore TR-NWT-000078/3 compliant
Test report(s) -
Certificate of Compliance Available
Environmental Load Unit 1.06
RoHS-Compliance Certificate Available
User's Guidelines English
Thinner DI-Water
Packaging  
Can (HDPE) [liter] 10
Drum (HDPE) [liter] 200
Shelf-life (Weeks)  
Storage 20 [°C] 104.
Storage 25 [°C] 90.

Fields of application

5 Especially made for this purpose
4 Generally qualified for this purpose
3 Generally usable, but not the best choice
2 Generally not usable for this purpose
1 Wrong choice
ISO 9454-1 2.1.3.A
IPC-ANSI-J-STD-004 ORL0
JIS Z 3197 2.1.3.N_I
No-Clean process 5
Post-solder cleaning 3
Selective Soldering 2
Pb-Free process - Ambient 3
Pb-Free process - N² 5
N²-Process - Full Tunnel 5
N²-Process - Wave Only 4
Consumer electronics 3
Med-Rel electronics 5
Hi-Rel electronics 4
1-layer, video/tv boards 3
2-layer boards 5
Multi-layer boards 5
OSP compatible 3
Ni/Au compatible 5
Ni/Pd compatible 4
Ag compatible 4
Sn compatible 5
Foam fluxing 1
Nozzle-spray fluxing 5
Moderate preheat 3
Short contact time with solder 4
Reduces skipped joints 5
Reduces solder balling 4
Reduces bridging 4
Promotes wicking 5
Cosmetic cleanliness 5
Cosmetic cleanliness N2 5
Dull/frosty joints 2
ICCT compatible 5
Conformal coating 3

*) Having a vapor pressure of >0.01 mm Hg @ 25°C
Industrial chemical product. Read MSDS before use.