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SMT Hybrid Packaging - Nuremberg, Germany

June 05 2018 - June 07 2018

Welcome to SMT Hybrid Packaging 2018, Europe's leading event on System Integration in Micro Electronics - the perfect information platform for you.

Be there when the whole industry comes together. Here you can see innovative products, future trends and a wide range of service offers. Moreover you van discuss solutions regarding the challenges you are faced to - from the idea to development and production of electronic assemblies.

Balver Zinn & Cobar will present the latest products and services in Hall 4, Booth #231.

Location: Exhibition center in Nuremberg - Germany


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