IPC International Conference in Frankfurt / May 20-21, 2010
Published: 15.03.2010
IPC Europe announces the IPC International Conference on Reliability and Quality of Lead-Free Electronics in Frankfurt AM, Germany, May 20-21, 2010. The event will feature renowned international industry experts and will focus on the most recent facts, trends and challenges in lead-free manufacturing influencing the quality and reliability of an assembled PCB. The conference and workshop sessions will offer information relevant to all facets of the electronics supply chain, and is essential for everyone in the industry, from electronic design and CAD to via bare board to assembling and soldering. On Thursday, May 20, the one-day conference seminars will cover the parameters that affect quality and reliability, how to reduce costs while increasing quality, design for reliability for lead-free electronic products, process qualification of lead-free process versus tin-lead and more. Three concurrent, half-day workshops are offered on Friday, May 21, offering attendees additional in-depth instruction on lead-free solder joint reliability — material properties and acceleration factors; increasing reliability and quality with the help of IPC standards; and reliability issues and solutions options for lead-free soldered electronic products. Attendees can register for the one-day conference, one of the three concurrent workshops or both. For complete information, visit www.ipc.org/calendar/2010/LF-Germany-0510/Leadfree-Conference.htm or contact IPC European Representative Lars Wallin at +46 08-26 10 07, or +46 070-212 74 39 or LarsWallin@ipc.org. See you in Frankfurt AM!
