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Balver Zinn Group to Exhibit a Host of Solder Materials at SMT Hybrid Packaging 2018

May 29 2018

The Balver Zinn Group announces that it will exhibit in Hall 4, Booth #231 at SMT Hybrid Packaging scheduled to take place June 5-7 in Nuremberg, Germany. The Balver Zinn Group will highlight the company’s latest products, technologies and services.

The Balver Zinn Group introduces 390-RX-HT+ a VOC flux with an organic activation system. The 390-RX-HT+ is a high reliability No-Clean flux for various soldering applications classified as ORL0 according IPC J-STD-004. This flux with high SIR values offers superior wetting performance with clear and dry residues.

Among the innovative technologies at the show will be Cobar’s extensive range of wave soldering and selective soldering fluxes:

  • 94-SEL a high reliability Low-VOC selective soldering flux shows excellent soldering performance and is qualified by high-tech and automotive companies in the electronics industry
  • 385-SEL a high-reliability selective flux designed specifically for selective soldering processes with short pre-heat and is besides that ideal for touch up applications
  • 95-RXN-M is a Low-VOC flux with a low solid content designed to eliminate solder balling and leaves a very low level of shiny, dry residues, preferable application in Nitrogen tunnel machine
  • 396-DRX-M+ is a VOC-free environmental friendly flux that exhibits powerful soldering performance combined with extremely low residues

Balver Zinn is a pioneer in lead free solders and as exclusive licensee we present Nihon Superiors new patented SN100CV® lead-free micro-alloyed solder. The industry standard SN100C® has been improved by the addition of bismuth which has positive effects on the reliability of the solder joints. The SN100CV® alloy offers high reliable solder joints which are recommended for high-end and automotive electronics.

The upcoming SMT trade show in Nuremberg is the German platform to discover Cobar’s wide range of lead-free and leaded solder paste alloys including low melting solder paste formulations.

 

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