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Balver Zinn Group Demonstrates Live Soldering Sessions at SMT Hybrid Packaging 2016

April 14 2016

Balver Zinn Group is pleased to announce a partnership with TBK GmbH regarding Hakko soldering equipment including demonstrations and live soldering sessions at SMT Hybrid Packaging scheduled to take place April 26-28 in Nuremberg, Germany. The Balver Zinn Group will highlight the company’s latest products, technologies and services at booth #7-320

Hakko is a globally recognized leader in high quality soldering and de-soldering tools. The addition of Hakko equipment will afford the Balver Zinn Group in combination with Balver Zinn solder wire the opportunity to offer customers more service and support.  Balver Zinn will demonstrate in cooperation with TBK GmbH the performance of SN100C® B2012 solder wire in combination with Hakko soldering equipment during live soldering sessions scheduled to take place every 2-3 hours. B2012 is odorless and shows excellent soldering and wetting performance. The no-clean, halide free solder wire was developed for rework and touch-up. 

Also on display at SMT Hybrid Packaging will be Cobar solder paste and fluxes and the unique and highly respected lead-free solder Balver Zinn SN100C® range.

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