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Events / News

January 23 2019 - January 24 2019

ETFN Technology Forum - Hamburg, Germany

The EFTN has firmly established itself in the calendar of the Germany electronics industry. With a perfect mix of theory and practice, the EFTN provides the latest topics and trends.

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January 29 2019 - January 31 2019

IPC APEX Expo 2019 - San Diego, USA


A future that drives success for the entire electronics industry becomes reality when the industry comes together.

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June 26 2018

Balver Zinn interviews - SMT Hybrid Packaging 2018

Josef Jost, Managing Director and Paolo Corviseri, Head of Technical Support and Area Sales Manager at the SMT Hybrid Packaging in Nuremberg!

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May 29 2018

Balver Zinn Group to Exhibit a Host of Solder Materials at SMT Hybrid Packaging 2018

The Balver Zinn Group announces that it will exhibit in Hall 4, Booth #231 at SMT Hybrid Packaging scheduled to take place June 5-7 in Nuremberg, Germany. The Balver Zinn Group will highlight the company’s latest products, technologies and services.

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