Cobar wave soldering flux 396-QMX

VOC-free flux with a special addition to reduce the solder balling effect on the PCB. The flux creates a thin residue layer on the PCB, preventing the solder from sticking to the solder resist.

IPC J-STD-004 classification REL0

Physical and chemical properties

SG @ 20 °C [kg/dm3] (+/- 0.5%) 1.009
Solids content [% w/w] 1.47
Halides [Silver-Chromate Test] Detected
Halides [Potentiometric] Detected
Acid number [mgKOH] (+/-2.5%) 15.59
Water content [% w/w] 96
VOC-content [% w/w] 3
Filmformer(s) Synthetic
Flashpoint COC [°C] -
Odor No
Color Colorless
Telcordia/bellcore TR-NWT-000078/3 Compliant
Test report(s) -
Certificate of Compliance Available
Environmental Load Unit 1.60
RoHS-Compliance Certificate Available
User's Guidelines English
Thinner Demi water
Packaging  
Can (HDPE) [liter] 10
Drum (HDPE) [liter] 200
Shelf-life (Weeks)  
Storage 20 [°C] 104
Storage 25 [°C] 90

Fields of application

5 Especially made for this purpose
4 Generally qualified for this purpose
3 Generally usable, but not the best choice
2 Generally not usable for this purpose
1 Wrong choice
ISO 9454-1 1.2.2.A.
IPC-ANSI-J-STD-004 REL1
JIS Z 3197 1.2.3.N_II
No-Clean process 5
Post-solder cleaning 2
Selective Soldering 2
Pb-Free process - Ambient 4
Pb-Free process - N² 5
N²-Process - Full Tunnel 5
N²-Process - Wave Only 5
Consumer electronics 4
Med-Rel electronics 5
Hi-Rel electronics 4
1-layer, video/tv boards 4
2-layer boards 5
Multi-layer boards 5
OSP compatible 5
Ni/Au compatible 5
Ni/Pd compatible 5
Ag compatible 5
Sn compatible 5
Foam fluxing 1
Nozzle-spray fluxing 5
Moderate preheat 3
Short contact time with solder 4
Reduces skipped joints 5
Reduces solder balling 5
Reduces bridging 5
Promotes wicking 5
Cosmetic cleanliness 3
Cosmetic cleanliness N2 4
Dull/frosty joints 2
ICCT compatible 5
Conformal coating 2

*) Having a vapor pressure of >0.01 mm Hg @ 25°C
Industrial chemical product. Read MSDS before use.