Cobar wave soldering flux 95-RXZ-M

95-RXZ-M is a low-VOC-based flux designed to optimize reliability and soldering performance. This flux has superior performance in anti-solderballing. Residues can remain on the PCB and it provides optimum pin testability and high SIR values.

IPC J-STD-004 classification REL0

Physical and chemical properties

SG @ 20 °C [kg/dm3] (+/- 0.5%) 0.900
Solids content [% w/w] 1.80
Halides [Silver-Chromate Test] Pass
Halides [Potentiometric] Pass
Acid number [mgKOH] (+/-2.5%) 15.90
Water content [% w/w] 40
VOC-content [% w/w] 58
Filmformer(s) Synthetic
Flashpoint COC [°C] 19.3
Odor Mild alcoholic
Color Colorless
Telcordia/bellcore TR-NWT-000078/3 Compliant
Test report(s) -
Certificate of Compliance Available
Environmental Load Unit 4.20
RoHS-Compliance Certificate Available
User's Guidelines English
Thinner 308-00
Packaging  
Can (HDPE) [liter] 10
Drum (HDPE) [liter] 200
Shelf-life (Weeks)  
Storage 20 [°C] 52
Storage 25 [°C] 40

Fields of application

5 Especially made for this purpose
4 Generally qualified for this purpose
3 Generally usable, but not the best choice
2 Generally not usable for this purpose
1 Wrong choice
ISO 9454-1 1.2.3.A
IPC-ANSI-J-STD-004 REL0
JIS Z 3197 1.2.3.N_1
No-Clean process 5
Post-solder cleaning 4
Selective Soldering 4
Pb-Free process - Ambient 4
Pb-Free process - N² 5
N²-Process - Full Tunnel 4
N²-Process - Wave Only 5
Consumer electronics 4
Med-Rel electronics 5
Hi-Rel electronics 4
1-layer, video/tv boards 3
2-layer boards 5
Multi-layer boards 5
OSP compatible 5
Ni/Au compatible 5
Ni/Pd compatible 5
Ag compatible 4
Sn compatible 5
Foam fluxing 5
Nozzle-spray fluxing 5
Moderate preheat 4
Short contact time with solder 5
Reduces skipped joints 5
Reduces solder balling 5
Reduces bridging 5
Promotes wicking 5
Cosmetic cleanliness 3
Cosmetic cleanliness N2 4
Dull/frosty joints 2
ICCT compatible 5
Conformal coating 3

*) Having a vapor pressure of >0.01 mm Hg @ 25°C
Industrial chemical product. Read MSDS before use.